SCDS187D February   2005  – June 2025 TS5A3167

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics for 5V Supply
    6. 5.6 Electrical Characteristics for 3.3V Supply
    7. 5.7 Electrical Characteristics for 2.5V Supply
    8. 5.8 Electrical Characteristics for 1.8V Supply
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Isolation in Powered-Off Mode, VCC = 0
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information Disclaimer
    2. 8.2 Application Information
    3. 8.3 Typical Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
    4.     Power Supply Recommendations
    5. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
  11. 10Revision History
  12.   Mechanical, Packaging, and Orderable Information

Thermal Information

THERMAL METRIC(1)TS5A3167UNIT
DBV (SOT-23)DCK (SOT-23)YZP (DSBGA)
5 PINS5 PINS5 PINS
RθJAJunction-to-ambient thermal resistance230.3268.0146.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance111.9171.81.4°C/W
RθJBJunction-to-board thermal resistance69.564.539.3°C/W
ψJTJunction-to-top characterization parameter33.040.50.7°C/W
ψJBJunction-to-board characterization parameter69.062.939.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/A°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.