SCDS187D February   2005  – June 2025 TS5A3167

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics for 5V Supply
    6. 5.6 Electrical Characteristics for 3.3V Supply
    7. 5.7 Electrical Characteristics for 2.5V Supply
    8. 5.8 Electrical Characteristics for 1.8V Supply
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Isolation in Powered-Off Mode, VCC = 0
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information Disclaimer
    2. 8.2 Application Information
    3. 8.3 Typical Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
    4.     Power Supply Recommendations
    5. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
  11. 10Revision History
  12.   Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision C (August 2018) to Revision D (June 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Moved Parameter Description table from Section 9 to Section 6 Go

Changes from Revision B (March 2017) to Revision C (August 2018)

  • Changed the DSBGA Body Size From: 1.50 mm x 9.00 mm To: 1.50 mm x 0.90 mm in the Device Information tableGo
  • Changed the YZP package pinout view From: Top View To: Bottom View Go