SCES643K November   2006  – July 2025 TXB0108

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (DGS/RUK/RKS)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements: VCCA = 1.2V
    8. 5.8  Timing Requirements: VCCA = 1.5V ± 0.1V
    9. 5.9  Timing Requirements: VCCA = 1.8V ± 0.15V
    10. 5.10 Timing Requirements: VCCA = 2.5V ± 0.2V
    11. 5.11 Timing Requirements: VCCA = 3.3V ± 0.3V
    12. 5.12 Switching Characteristics: VCCA = 1.2V (DGS/RUK/RKS)
    13. 5.13 Switching Characteristics: VCCA = 1.2V (Other Packages)
    14. 5.14 Switching Characteristics: VCCA = 1.5V ± 0.1V (DGS/RUK/RKS)
    15. 5.15 Switching Characteristics: VCCA = 1.5V ± 0.1V (Other Packages)
    16. 5.16 Switching Characteristics: VCCA = 1.8V ± 0.15V (DGS/RUK/RKS)
    17. 5.17 Switching Characteristics: VCCA = 1.8V ± 0.15V (Other Packages)
    18. 5.18 Switching Characteristics: VCCA = 2.5V ± 0.2V (DGS/RUK/RKS)
    19. 5.19 Switching Characteristics: VCCA = 2.5V ± 0.2V (Other Packages)
    20. 5.20 Switching Characteristics: VCCA = 3.3V ± 0.3V (DGS/RUK/RKS)
    21. 5.21 Switching Characteristics: VCCA = 3.3V ± 0.3V (Other Packages)
    22. 5.22 Operating Characteristics
    23. 5.23 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

7.3.5 Pullup or Pulldown Resistors on I/O Lines

The TXB0108 is designed to drive capacitive loads of up to 70pF. The output drivers of the TXB0108 have low dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be kept higher than 50kΩ to ensure that they do not contend with the output drivers of the TXB0108. For the same reason, the TXB0108 should not be used in applications such as I2C or 1-Wire where an open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI TXS01xx series of level translators.