SCES650K April   2006  – March 2025 TXB0104

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (BQA/DYY)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements: VCCA = 1.2 V
    8. 5.8  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    9. 5.9  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    10. 5.10 Timing Requirements: VCCA = 2.5 V ± 0.2 V
    11. 5.11 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    12. 5.12 Switching Characteristics: VCCA = 1.2 V (BQA/DYY)
    13. 5.13 Switching Characteristics: VCCA = 1.2 V (Other Packages)
    14. 5.14 Switching Characteristics: VCCA = 1.5 V ± 0.1 V (BQA/DYY)
    15. 5.15 Switching Characteristics: VCCA = 1.5 V ± 0.1 V (Other Packages)
    16. 5.16 Switching Characteristics: VCCA = 1.8 V ± 0.15 V (BQA/DYY)
    17. 5.17 Switching Characteristics: VCCA = 1.8 V ± 0.15 V (Other Packages)
    18. 5.18 Switching Characteristics: VCCA = 2.5 V ± 0.2 V (BQA/DYY)
    19. 5.19 Switching Characteristics: VCCA = 2.5 V ± 0.2 V (Other Packages)
    20. 5.20 Switching Characteristics: VCCA = 3.3 V ± 0.3 V (BQA/DYY)
    21. 5.21 Switching Characteristics: VCCA = 3.3 V ± 0.3 V (Other Packages)
    22. 5.22 Operating Characteristics: VCCA = 1.2 V to 1.5 V, VCCB = 1.5 V to 1.8 V
    23. 5.23 Operating Characteristics: VCCA = 1.8 V to 3.3 V, VCCB = 1.8 V to 5 V
    24. 5.24 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

12 Revision History

Changes from Revision J (October 2020) to Revision K (March 2025)

  • Added BQA and DYY packagesGo
  • Added thermal information for BQA and DYY packagesGo

Changes from Revision I (March 2018) to Revision J (October 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added NMN Package, 12-Pin NFBGA pinout drawing in Pin Configuration and Functions sectionGo

Changes from Revision H (January 2018) to Revision I (March 2018)

  • Updated Pin Functions table Go
  • Added Pin Assignments table for YZT package Go
  • Added Pin Assignments table for GXU and ZXU package Go
  • Updated Layout Example Go

Changes from Revision G (November 2014) to Revision H (January 2018)

  • Added Package, families to Package, pinout drawings in Pin Configuration and Functions section Go
  • Added junction temperature range in Absolute Maximum RatingstableGo
  • Changed unit from V to kV in ESD Ratings tableGo

Changes from Revision F (May 2012) to Revision G (November 2014)

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go