SCES650K April   2006  – March 2025 TXB0104

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (BQA/DYY)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements: VCCA = 1.2 V
    8. 5.8  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    9. 5.9  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    10. 5.10 Timing Requirements: VCCA = 2.5 V ± 0.2 V
    11. 5.11 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    12. 5.12 Switching Characteristics: VCCA = 1.2 V (BQA/DYY)
    13. 5.13 Switching Characteristics: VCCA = 1.2 V (Other Packages)
    14. 5.14 Switching Characteristics: VCCA = 1.5 V ± 0.1 V (BQA/DYY)
    15. 5.15 Switching Characteristics: VCCA = 1.5 V ± 0.1 V (Other Packages)
    16. 5.16 Switching Characteristics: VCCA = 1.8 V ± 0.15 V (BQA/DYY)
    17. 5.17 Switching Characteristics: VCCA = 1.8 V ± 0.15 V (Other Packages)
    18. 5.18 Switching Characteristics: VCCA = 2.5 V ± 0.2 V (BQA/DYY)
    19. 5.19 Switching Characteristics: VCCA = 2.5 V ± 0.2 V (Other Packages)
    20. 5.20 Switching Characteristics: VCCA = 3.3 V ± 0.3 V (BQA/DYY)
    21. 5.21 Switching Characteristics: VCCA = 3.3 V ± 0.3 V (Other Packages)
    22. 5.22 Operating Characteristics: VCCA = 1.2 V to 1.5 V, VCCB = 1.5 V to 1.8 V
    23. 5.23 Operating Characteristics: VCCA = 1.8 V to 3.3 V, VCCB = 1.8 V to 5 V
    24. 5.24 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

10.1 Layout Guidelines

To ensure reliability of the device, following common printed-circuit board layout guidelines is recommended.

  • Bypass capacitors must be used on power supplies, and must be placed as close as possible to the VCCA, VCCB pin and GND pin.
  • Short trace-lengths must be used to avoid excessive loading.
  • PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one-shot duration, approximately 10 ns, ensuring that any reflection encounters low impedance at the source driver.