SCES650K April   2006  – March 2025 TXB0104

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (BQA/DYY)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements: VCCA = 1.2 V
    8. 5.8  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    9. 5.9  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    10. 5.10 Timing Requirements: VCCA = 2.5 V ± 0.2 V
    11. 5.11 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    12. 5.12 Switching Characteristics: VCCA = 1.2 V (BQA/DYY)
    13. 5.13 Switching Characteristics: VCCA = 1.2 V (Other Packages)
    14. 5.14 Switching Characteristics: VCCA = 1.5 V ± 0.1 V (BQA/DYY)
    15. 5.15 Switching Characteristics: VCCA = 1.5 V ± 0.1 V (Other Packages)
    16. 5.16 Switching Characteristics: VCCA = 1.8 V ± 0.15 V (BQA/DYY)
    17. 5.17 Switching Characteristics: VCCA = 1.8 V ± 0.15 V (Other Packages)
    18. 5.18 Switching Characteristics: VCCA = 2.5 V ± 0.2 V (BQA/DYY)
    19. 5.19 Switching Characteristics: VCCA = 2.5 V ± 0.2 V (Other Packages)
    20. 5.20 Switching Characteristics: VCCA = 3.3 V ± 0.3 V (BQA/DYY)
    21. 5.21 Switching Characteristics: VCCA = 3.3 V ± 0.3 V (Other Packages)
    22. 5.22 Operating Characteristics: VCCA = 1.2 V to 1.5 V, VCCB = 1.5 V to 1.8 V
    23. 5.23 Operating Characteristics: VCCA = 1.8 V to 3.3 V, VCCB = 1.8 V to 5 V
    24. 5.24 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)TXB0104UNIT
DGXU/ZXUPWRGYRUTYZTNMN

BQA

DYY

14 PINS12 PINS14 PINS14 PINS12 PINS12 PINS12 PINS

14 PINS

14 PINS

RθJAJunction-to-ambient thermal resistance90.7127.1121.052.8119.889.2134.3

77.1

165.0

°C/W
RθJC(top)Junction-to-case (top) thermal resistance50.592.850.067.742.60.990.7

80.7

87.5

RθJBJunction-to-board thermal resistance45.462.262.828.952.514.488.4

46.9

83.2

ψJTJunction-to-top characterization parameter14.72.36.42.60.73.04.3

6.1

9.3

ψJBJunction-to-board characterization parameter45.162.262.229.052.314.489.3

46.8

83.1

RθJC(bot)Junction-to-case (bottom) thermal resistance───────

23.3

-

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.