SCES983B October   2025  – June 2026 TXB0604

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.9V
    7. 5.7  Switching Characteristics, VCCA = 1.2V ± 0.1V
    8. 5.8  Switching Characteristics, VCCA = 1.5V ± 0.1V
    9. 5.9  Switching Characteristics, VCCA = 1.8V ± 0.15V
    10. 5.10 Switching Characteristics: TMAX (-40°C to 125°C) 
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
      6. 7.3.6 Dummy Cycles
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

10.1 Layout Guidelines

To ensure reliability of the device, following common printed-circuit board layout guidelines is recommended.

  • The TXB0604 provides bidirectional level translation with symmetrical drive strength on both ports. Therefore, device placement between the host and target is not critical, provided the capacitive load on either side remains within the specified 100pF limit.
  • Bypass capacitors must be used on power supplies, and must be placed as close as possible to the VCCA, VCCB pin and GND pin.
  • Series resistors must be placed at the device outputs to improve signal integrity and match the total output impedance to the external transmission path. For example, given that the device output impedance is 21Ω, a 30Ω series resistor provides an effective source impedance close to 50Ω, matching a typical controlled-impedance PCB trace or cable connection.
  • During operation, the data direction changes dynamically between the host and the target device. A direction-change delay (tDCW) must be provided before the bus switches direction between the host and target device. Ensure that the delay between direction changes meets the tDCW requirement listed in the Switching Characteristics table. In QSPI applications, this delay corresponds to dummy clock cycles inserted between the command/address and data phases to satisfy the required turn-around time.