SCES983B October   2025  – June 2026 TXB0604

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.9V
    7. 5.7  Switching Characteristics, VCCA = 1.2V ± 0.1V
    8. 5.8  Switching Characteristics, VCCA = 1.5V ± 0.1V
    9. 5.9  Switching Characteristics, VCCA = 1.8V ± 0.15V
    10. 5.10 Switching Characteristics: TMAX (-40°C to 125°C) 
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
      6. 7.3.6 Dummy Cycles
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TXB0604 UNIT
RUT (UQFN) DYY (SOT-23) PW (TSSOP) RWB (X2QFN) RGY (VQFN)
12 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 199.2 165.4 127.4 185.88 73.93 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 19.2 87.0 60.4 79.14 70.39 °C/W
RθJB Junction-to-board thermal resistance 117.6 85.6 83.6 105.76 48.37 °C/W
YJT Junction-to-top characterization parameter 117.7 10.3 10.1 5.64 12.06 °C/W
YJB Junction-to-board characterization parameter 97.1 84.5 82.7 105.93 48.45 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a 32.37 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.