SCLS239P October   1995  – July 2025 SN54AHCT373 , SN74AHCT373

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   5
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements, VCC = 5V ±0.5V
    7. 5.7  Switching Characteristics, VCC = 5V ±0.5V
    8. 5.8  Noise Characteristics
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  8. 6 Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 TTL-Compatible CMOS Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12. 10Revision History
  13. 11Mechanical, Packaging, and Orderable Information

10 Revision History

Changes from Revision O (August 2024) to Revision P (July 2025)

  • Added RKS and DGS packagesGo

Changes from Revision N (August 2023) to Revision O (August 2024)

  • Added package size to Device Information tableGo
  • Updated RθJA values: PW = 83 to 116.8, all values in °C/W Go

Changes from Revision M (July 2023) to Revision N (August 2023)

  • Added Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Device Functional Modes, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo