For printed circuit board (PCB) layout of the TXE8116, common PCB layout practices must be followed but additional concerns related to high-speed data transfer such as matched impedance and differential pairs are not a concern for SPI signal speeds.

In all PCB layouts, avoiding right angles in signal traces, fanning out signal traces away from each other upon leaving the vicinity of an integrated circuit (IC), and using thicker trace widths to carry higher amounts of current that commonly pass through power and ground traces is best practice. By-pass and decoupling capacitors are commonly used to control the voltage on the supply pins, using a larger capacitor to provide additional power in the event of a short power supply glitch and a smaller capacitor to filter out high-frequency ripple. These capacitors must be placed as close to the TXE8116 as possible. These best practices are shown in Layout Example.

For the layout example provided in Layout Example, fabricating a PCB with only 2 layers by using the top layer for signal routing and the bottom layer as a split plane for power and ground (GND) is possible. However, a 4 layer board is preferable for boards with higher density signal routing. On a 4 layer PCB, routing signals on the top and bottom layer, dedicating one internal layer to a ground plane, and dedicating the other internal layer to a power plane is common. In a board layout using planes or split planes for power and ground, vias are placed directly next to the surface mount component pad which needs to attach to power or GND and the via is connected electrically to the internal layer or the other side of the board. Vias are also used when a signal trace needs to be routed to the opposite side of the board, but this technique is not demonstrated in Layout Example.