SDAA353 May   2026 TAS5802 , TAS5805M , TAS5815 , TAS5822M , TAS5825M , TAS5825P , TAS5827 , TAS5828M , TAS5830

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
  5. 2 Key TAS58xx Amplifier Parameters and Specifications
  6. 3 Benefits and Key Features of TAS58xx Devices
    1. 3.1 Efficiency Feature: Class H
    2. 3.2 Modulation Schemes: 1SPW, BD, Hybrid
      1. 3.2.1 1SPW Modulation
      2. 3.2.2 BD Modulation
      3. 3.2.3 Hybrid Modulation
      4. 3.2.4 Protection Features
        1. 3.2.4.1 Over-Current Protection (OCP)
        2. 3.2.4.2 Cycle-by-Cycle Current Limit
        3. 3.2.4.3 Over/Under-Voltage Protection (OVP/UVP)
        4. 3.2.4.4 Over-Temperature Protection (OTP)
        5. 3.2.4.5 Thermal Foldback
        6. 3.2.4.6 Short-Circuit Protection (SCP)
        7. 3.2.4.7 DC Protection
        8. 3.2.4.8 PVDD Sensing
    3. 3.3 Tuning and Audio Processing Blocks
      1. 3.3.1 Input Mixer
      2. 3.3.2 Equalizer
      3. 3.3.3 DEPQ
      4. 3.3.4 3-Band DRC
      5. 3.3.5 Dynamic vs. Hard Limiting to Avoid Clipping
        1. 3.3.5.1 AGL
        2. 3.3.5.2 Limiter/Clipper
        3. 3.3.5.3 Output Crossbar
    4. 3.4 EMI Features
      1. 3.4.1 Spread Spectrum
      2. 3.4.2 Phase Sync
  7. 4 Comparing Key TAS58xx Devices
  8. 5 Application-Specific Requirements
    1. 5.1 Bluetooth Speakers
    2. 5.2 Televisions and Soundbars
    3. 5.3 General Audio Applications (Home Stereo, Gaming, and so on)
  9. 6 Application-Specific Recommendations: Utilizing TAS58xx
    1. 6.1 Bluetooth Speakers
    2. 6.2 Television and Soundbars
    3. 6.3 General Audio (Home Stereo, Gaming)
  10. 7 PCB Layout Best Practices for TAS58xx
    1. 7.1 Ground Plane: Pad Up vs Pad Down
    2. 7.2 Trace Width
    3. 7.3 Component Placement
    4. 7.4 Thermal Vias
  11. 8 Design Guidelines and Evaluation (TI Tools and Resources)
  12. 9 Summary
  13. 10References

7.1 Ground Plane: Pad Up vs Pad Down

TI's TAS58xx devices must be connected to a heat sink via thermal pad that is either on the top (pad up) or bottom (pad down). Pad down devices offer the benefit of a smaller footprint with no external heat sink required. For superior thermal performance, pad up devices are recommended since an external heat sink is typically better at dissipating heat than thinner ground layers in a PCB stack up.