SFFS842A March   2024  – May 2025 TMCS1123-Q1 , TMCS1126-Q1 , TMCS1127-Q1 , TMCS1133-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TMCS1123-Q1 Pin FMA
    2. 4.2 TMCS1126-Q1 Pin FMA
    3. 4.3 TMCS1127-Q1 Pin FMA
    4. 4.4 TMCS1133-Q1 Pin FMA
  7. 5Revision History

1 Overview

This document contains information for TMCS1123-Q1, TMCS1126-Q1, TMCS1127-Q1, and TMCS1133-Q1 (SOIC package) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram of TMCS1123-Q1 for reference. Refer to the individual data sheets for the function block diagram of the actual product.

TMCS1126-Q1 TMCS1133-Q1 TMCS1123-Q1 TMCS1127-Q1 TMCS1123-Q1Functional Block Diagram Figure 1-1 TMCS1123-Q1Functional Block Diagram

The TMCS1123-Q1, TMCS1126-Q1, TMCS1127-Q1, and TMCS1133-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.