SFFS924A August   2024  – February 2025 SN74LV4051A-Q1 , SN74LV4052A-Q1 , SN74LV4053A-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP Package
    2. 2.2 SOIC Package
    3. 2.3 SOT-23-THIN Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SN74LV4051A-Q1: TSSOP, SOIC, and SOT-23-THIN Packages
    2. 4.2 SN74LV4052A-Q1: TSSOP and SOT-23-THIN Packages
    3. 4.3 SN74LV4053A-Q1: TSSOP and SOT-23-THIN Packages
  7. 5Revision History

1 Overview

This document contains information for the SN74LV405xA-Q1 (TSSOP, SOIC, and the SOT-23-THIN packages) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

Figure 1-1 Functional Block DiagramSN74LV405xA-Q1

The SN74LV405xA-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.