SN74LV4052A-Q1

ACTIVE

Automotive 5-V, 4:1, 2-channel analog multiplexer

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Automotive 5-V, 4:1, 2-channel analog multiplexer

SN74LV4052A-Q1

ACTIVE

Product details

Parameters

Configuration 4:1 Number of channels (#) 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 100 ON-state leakage current (Max) (µA) 2 Bandwidth (MHz) 50 Operating temperature range (C) -40 to 105, -40 to 125 Input/output continuous current (Max) (mA) 25 Rating Automotive CON (Typ) (pF) 5.6 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 TSSOP (PW) 16 22 mm² 5 x 4.4 TSSOP (PW) 16 22 mm² 4.4 x 5 open-in-new Find other Analog switches & muxes

Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C
      Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C4B
  • Supports Mixed-Mode Voltage Operation on All Ports
  • Fast Switching
  • High On-Off Output-Voltage Ratio
  • Low Crosstalk Between Switches
  • Extremely Low Input Current
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Description

These dual 4-channel CMOS analog multiplexers and demultiplexers are designed for 2-V to 5.5-V VCC operation.

The SN7LV4052A-Q1 devices handle both analog and digital signals. Each channel permits signals with amplitudes up to 5.5 V (peak).

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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NEW TMUX1309-Q1 ACTIVE Automotive, 2-channel, 4:1 general-purpose analog multiplexer with 1.8-V logic control Upgraded 1.8-V logic support and smaller package options

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 4
Type Title Date
* Datasheet SN74LV4052A-Q1 Dual 4-Channel Analog Multiplexers and Demultiplexers datasheet (Rev. F) Dec. 24, 2014
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
More literature Automotive Logic Devices Brochure Aug. 27, 2014

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
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Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Reference designs

REFERENCE DESIGNS Download
Cascade imaging radar capture reference design using Jacinto™ ADAS processor
TIDEP-01017 The cascade development kit has two main use cases:
  1. To use the MMWCAS-DSP-EVM as a capture card to fully evaluate the AWR2243 four-chip cascade performance by using the mmWave studio tool, please read the TIDEP-01012 design guide.
  2. To use the MMWCAS-DSP-EVM to develop radar real time SW application (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
TSSOP (PW) 16 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

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