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SN74LV4053A-Q1

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Automotive 5-V, 2:1 (SPDT), 3-channel analog multiplexer

Data sheet
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Automotive 5-V, 2:1 (SPDT), 3-channel analog multiplexer

SN74LV4053A-Q1

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Data sheet Order now

Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 3 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 23 ON-state leakage current (Max) (µA) 2 Bandwidth (MHz) 50 Operating temperature range (C) -40 to 105, -40 to 125 Input/output continuous current (Max) (mA) 25 Rating Automotive CON (Typ) (pF) 5.6 open-in-new Find other Analog switches & muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 TSSOP (PW) 16 22 mm² 5 x 4.4 open-in-new Find other Analog switches & muxes

Features

  • Qualified for Automotive Applications
  • ESD Protection Exceeds 2000 V Per MIL-STD-883,
    Method 3015; Exceeds 200 V Using Machine Model
    (C = 200 pF, R = 0)
  • 2-V to 5.5-V VCC Operation
  • Supports Mixed-Mode Voltage Operation on All Ports
  • High On-Off Output-Voltage Ratio
  • Low Crosstalk Between Switches
  • Individual Switch Controls
  • Extremely Low Input Current

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Description

This triple 2-channel CMOS analog multiplexer/demultiplexer is designed for 2-V to 5.5-V VCC operation.

The SN74LV4053A handles both analog and digital signals. Each channel permits signals with amplitudes up to 5.5 V (peak) to be transmitted in either direction.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 4
Type Title Date
* Datasheet Automotive Catalog Triple 2-Channel Analog Multiplexer/Demultiplexer datasheet (Rev. C) Jun. 24, 2011
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
More literature Automotive Logic Devices Brochure Aug. 27, 2014

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


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Reference designs

REFERENCE DESIGNS Download
Battery Tester Reference Design for High Current Applications
TIDA-01040 — Li-Ion battery formation and electrical testing require accurate voltage and current control, usually to better than ±0.05% over the specified temperature range.  This reference design proposes a solution for high-current (up to 50 A) battery tester applications supporting input (bus (...)
document-generic Schematic
REFERENCE DESIGNS Download
Battery tester reference design for multi-phase high-precision 0.5 to 100 A battery formation
TIDA-01041 — This reference design provides a multi-phase solution for a wide range of current battery test applications. Leveraging the dual phase buck/boost controller LM5170's daisy chain configuration gives the design the ability to achieve 100A charging/discharging rates. Utilizing high accuracy constant (...)
document-generic Schematic
REFERENCE DESIGNS Download
Modular battery tester reference design for 50-A, 100-A, and 200-A applications
TIDA-01042 — This reference design provides a modular battery test solution allowing users to have the flexibility to test batteries at different current levels with one design. This design leverages the TIDA-01041 reference design by providing two 100-A battery testers that can work independently or be (...)
document-generic Schematic

CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
TSSOP (PW) 16 View options

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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