Automotive 5-V, 2:1 (SPDT), 3-channel analog multiplexer
Product details
Parameters
Package | Pins | Size
Features
- Qualified for Automotive Applications
- ESD Protection Exceeds 2000 V Per MIL-STD-883,
Method 3015; Exceeds 200 V Using Machine Model
(C = 200 pF, R = 0) - 2-V to 5.5-V VCC Operation
- Supports Mixed-Mode Voltage Operation on All Ports
- High On-Off Output-Voltage Ratio
- Low Crosstalk Between Switches
- Individual Switch Controls
- Extremely Low Input Current
Description
This triple 2-channel CMOS analog multiplexer/demultiplexer is designed for 2-V to 5.5-V VCC operation.
The SN74LV4053A handles both analog and digital signals. Each channel permits signals with amplitudes up to 5.5 V (peak) to be transmitted in either direction.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | Automotive Catalog Triple 2-Channel Analog Multiplexer/Demultiplexer datasheet (Rev. C) | Jun. 24, 2011 |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
More literature | Automotive Logic Devices Brochure | Aug. 27, 2014 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Reference designs
Design files
-
download TIDA-01040 BOM.pdf (215KB) -
download TIDA-01040 Assembly Drawing.pdf (431KB) -
download TIDA-01040 PCB.pdf (5830KB) -
download TIDA-01040 CAD Files.zip (4178KB) -
download TIDA-01040 Gerber.zip (1352KB)
Design files
-
download TIDA-01041 BOM.pdf (213KB) -
download TIDA-01041 Assembly Drawing.pdf (497KB) -
download TIDA-01041 PCB.pdf (7425KB) -
download TIDA-01041 CAD Files.zip (24839KB) -
download TIDA-01041 Gerber.zip (1347KB)
Design files
-
download TIDA-01042 BOM.pdf (241KB) -
download TIDA-01042 Assembly Drawing.pdf (528KB) -
download TIDA-01042 PCB.pdf (7810KB) -
download TIDA-01042 CAD Files.zip (5259KB) -
download TIDA-01042 Gerber.zip (1270KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SOIC (D) | 16 | View options |
TSSOP (PW) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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