SFFSAJ9A June   2025  – September 2025 UCC27289

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC Package
    2. 2.2 VSON Package
  5. 3Failure Mode Distribution (FMD)
    1. 3.1 SOIC Package
    2. 3.2 VSON Package
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC Package
    2. 4.2 VSON Package
  7. 5Revision History

2.1 SOIC Package

This section provides functional safety failure in time (FIT) rates for the SOIC package of UCC27289 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-4 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11
FIT IEC TR 62380 / ISO 26262 Power Dissipation (mW) FIT (Failures Per 109 Hours)
Total component FIT rate 10 13
100 14
500 28
Die FIT rate 10 2
100 3
500 14
Package FIT rate 10 11
100 11
500 14

The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission profile: Motor control from table 11 or figure 16
  • Power dissipation: 10mW, 100mW, and 500mW
  • Climate type: World-wide table 8 or figure 13
  • Package factor (lambda 3): Table 17b or figure 15
  • Substrate material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2
Table Category Reference FIT Rate Reference Virtual TJ
5 CMOS, BICMOS,
Digital, analog, or mixed		 20 FIT 55°C

The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-4 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.