SFFSB18 August   2026 TLIN821-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC (D, 8) Package
    2. 2.2 VSON (DRB, 8) Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC (D, 8) Package
    2. 4.2 VSON (DRB, 8) Package
  7. 5Revision History

4.1 SOIC (D, 8) Package

Figure 4-1 shows the TLIN821-Q1 pin diagram for the SOIC (D, 8) package. For a detailed description of the device pins, see the Pin Configuration and Functions section in the TLIN821-Q1 datasheet.

TLIN821-Q1 Pin Diagram (D, 8-Pin (SOIC)) PackageFigure 4-1 Pin Diagram (D, 8-Pin (SOIC)) Package
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
RXD 1 The RXD pin is biased dominant; communication from the LIN bus to the MCU is not possible. B
EN 2 The device potentially only operates in standby mode after power-on. If a short occurs in normal mode, the part is forced to enter sleep mode and potentially disables LIN communication. B
WAKE 3 The WAKE pin is biased to ground and a local wake up is not possible. B
TXD 4 The TXD pin is biased dominant; communication from the MCU to the LIN bus is not possible. B
GND 5 None D
LIN 6 The LIN pin is biased dominant; LIN communication is not possible. B
VSUP 7 The device is not powered and does not function. B
INH 8 The INH pin is biased to GND and is not able to enable system power if used in this manner. B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
RXD 1 Communication from the LIN bus to the MCU is not possible. B
EN 2 The EN pin is biased low due to internal pulldown, so the device is in standby mode. B
WAKE 3 Local wake up is not possible. B
TXD 4 Communication from the MCU to the LIN bus is not possible. B
GND 5 The device is not powered and does not function. B
LIN 6 LIN communication is not possible. B
VSUP 7 The device is not powered and does not function. B
INH 8 The INH pin is not able to enable system power if used in this manner. B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effects Failure Effect Class
RXD 1 EN The device goes into sleep mode when a dominant bit is received on the LIN bus, disabling communication. B
EN 2 WAKE The absolute maximum voltage on the EN pin is potentially exceeded causing damage to EN pin. A
WAKE 3 TXD The absolute maximum voltage on the WAKE pin is potentially exceeded causing damage to TXD pin. A
GND 5 LIN The LIN pin is biased dominant, LIN communication is not possible. B
LIN 6 VSUP The LIN pin is biased recessive, LIN communication is not possible. B
VSUP 7 INH The INH pin is biased high and is not able to turn off system power if used in this manner. B
Table 4-5 Pin FMA for Device Pins Short-Circuited to VSUP Supply
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
RXD 1 There is an absolute maximum voltage violation, and the transceiver is potentially damaged. A
EN 2 There is an absolute maximum voltage violation, and the transceiver is potentially damaged. A
WAKE 3 The WAKE pin is biased high and a local wake up is not possible. B
TXD 4 There is an absolute maximum voltage violation, and the transceiver is potentially damaged. A
GND 5 The device is not powered and does not function. A
LIN 6 The LIN pin is biased recessive, LIN communication is not possible. B
VSUP 7 None D
INH 8 The INH pin biased high and is not able to turn off system power if used in this manner. B