SGLS423B February   2025  – February 2026 SN55LVRA4-SEP

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Pin Configuration and Functions
6. 5 Specifications
   1. 5.1 Absolute Maximum Ratings
   2. 5.2 ESD Ratings
   3. 5.3 Recommended Operating Conditions
   4. 5.4 Thermal Information
   5. 5.5 Electrical Characteristics
   6. 5.6 Switching Characteristics
   7. 5.7 Typical Characteristics
7. 6 Parameter Measurement Information
8. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Receiver Output States
      2. 7.3.2 General Purpose Comparator
      3. 7.3.3 Common-Mode Range vs Supply Voltage
   4. 7.4 Equivalent Input and Output Schematic Diagrams
   5. 7.5 Device Functional Modes
9. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
      2. 8.2.2 Design Requirements
      3. 8.2.3 Application Performance Plots
      4. 8.2.4 Cold Sparing
   3. 8.3 Active Failsafe Feature
   4. 8.4 ECL/PECL-to-LVTTL Conversion with TI's LVDS Receiver
   5. 8.5 Test Conditions
   6. 8.6 Equipment
10. 9 Power Supply Recommendations
    1. 9.1 Supply Bypass Capacitance
11. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 Microstrip vs. Stripline Topologies
       2. 10.1.2 Dielectric Type and Board Construction
       3. 10.1.3 Recommended Stack Layout
       4. 10.1.4 Separation Between Traces
       5. 10.1.5 Crosstalk and Ground Bounce Minimization
    2. 10.2 Layout Example
12. 11Device and Documentation Support
    1. 11.1 Documentation Support
       1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
13. 12Revision History
14. 13Mechanical, Packaging, and Orderable Information