SLAAEO4 November   2025 MSPM0G3507 , MSPM0L1306

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Introduction
    1. 1.1 Terminology
  5. 2 NONMAIN Architecture
    1. 2.1 MSPM0 Family Overview
    2. 2.2 NONMAIN Configuration Overview
    3. 2.3 NONMAIN Memory
  6. 3 NONMAIN Configuration
    1. 3.1 BCR Configuration
      1. 3.1.1 BCR Configuration ID
      2. 3.1.2 Serial Wire Debug (SWD) Policy
        1. 3.1.2.1 Access Policy
        2. 3.1.2.2 Debug Policy
          1. 3.1.2.2.1 Plain Text Password Example
          2. 3.1.2.2.2 SHA2-256 Password Example
        3. 3.1.2.3 Mass Erase and Factory Reset Policy
        4. 3.1.2.4 TI Failure Analysis
      3. 3.1.3 Flash Memory Static Write Protection
        1. 3.1.3.1 MAIN Flash Static Write Protection
        2. 3.1.3.2 NONMAIN Flash Static Write Protection
      4. 3.1.4 Customer Secure Code (CSC)
        1. 3.1.4.1 CSC Policy
        2. 3.1.4.2 Flash Bank Swap Policy
        3. 3.1.4.3 Debug Hold
      5. 3.1.5 Fast Boot Mode
      6. 3.1.6 Application Digest Check
        1. 3.1.6.1 CRC32 Digest Check Example
        2. 3.1.6.2 SHA2-256 Digest Check Example
      7. 3.1.7 BSL Policy
      8. 3.1.8 BCR Checksum
        1. 3.1.8.1 CRC Check Fail Handling
    2. 3.2 BSL Configuration
      1. 3.2.1 BSL Configuration ID
      2. 3.2.2 Invoke Pin Configuration
      3. 3.2.3 ROM-Based Communication Interface
        1. 3.2.3.1 UART Interface
        2. 3.2.3.2 I2C Interface
        3. 3.2.3.3 USB Interface
      4. 3.2.4 Flash Plug-in Interface
      5. 3.2.5 Alternative BSL Interface
      6. 3.2.6 BSL Security Configuration
        1. 3.2.6.1 Access Password
        2. 3.2.6.2 Read-Out Feature
        3. 3.2.6.3 Alert Feature
        4. 3.2.6.4 Application Integrity Check
      7. 3.2.7 BSL Checksum
        1. 3.2.7.1 CRC Check Fail Handling
  7. 4 NONMAIN Configuration With SysConfig
    1. 4.1 SysConfig Introduction
    2. 4.2 BCR Configuration with SysConfig
      1. 4.2.1 Password Configuration
      2. 4.2.2 Flash Static Write Protection
      3. 4.2.3 Other BCR Configurations
    3. 4.3 BSL Configuration With SysConfig
      1. 4.3.1 BSL Access Password
      2. 4.3.2 BSL Invoke Pin Configuration
      3. 4.3.3 BSL Communication Interface
      4. 4.3.4 Flash Plug-in Interface
      5. 4.3.5 Alternative BSL Interface
      6. 4.3.6 Other BCR Configurations
  8. 5 NONMAIN Configuration in Application Code
  9. 6 NONMAIN Operation with IDE Tool
    1. 6.1 NONMAIN Configuration Files
    2. 6.2 Project Erase Property
    3. 6.3 Password-Protected Debug
  10. 7 NONMAIN Operation with Programmer Tool
    1. 7.1 NONMAIN Operation with UniFlash
    2. 7.2 NONMAIN Operation with J-Flash
    3. 7.3 NONMAIN Operation with C-GANG
    4. 7.4 NONMAIN Operation with MSP-GANG
  11. 8 Frequently Asked Questions (FAQs)
    1. 8.1 MCU Locked State Analysis
      1. 8.1.1 Hardware Issue Analysis
        1. 8.1.1.1 Hardware Circuit Design
        2. 8.1.1.2 Debugger Connection
        3. 8.1.1.3 External Reset Signal
      2. 8.1.2 Software Issue Analysis
        1. 8.1.2.1 CPU Enters a Fault State
        2. 8.1.2.2 BCR Configuration
        3. 8.1.2.3 Low Power Mode (STOP or STANDBY)
        4. 8.1.2.4 SHUTDOWN IO State
        5. 8.1.2.5 SWD IO Function
        6. 8.1.2.6 WDT or IWDT Reset
        7. 8.1.2.7 Software POR or BOOTRST
    2. 8.2 Unlock the MSPM0 Device
      1. 8.2.1 Force MCU to Enter BSL Mode
      2. 8.2.2 Send BSL Command
      3. 8.2.3 Generate DSSM Command
    3. 8.3 Debug Error Overview
      1. 8.3.1 No Error Code: DAP Connection Error
      2. 8.3.2 No Error Code: Connection to MSPM0 Core Failed
      3. 8.3.3 Error - 6305: PRSC Module Failed to Write a Routine Register
      4. 8.3.4 Error - 260: An Attempt to Connect to the XDS110 Failed
      5. 8.3.5 Error - 261: Invalid Response From the XDS110
      6. 8.3.6 Error - 615: Target Fails to Identify a Correctly Formatted SWD Header
      7. 8.3.7 Error - 1001: Requested Operation is not Supported on This Device
      8. 8.3.8 Error - 2131: Unable to Access Device Register
    4. 8.4 MSPM0 Boot Diagnostic
  12. 9 Summary
  13. 10References

8.1.2.4 SHUTDOWN IO State

The digital IO pin states latch and retain upon entry to SHUTDOWN. The digital IO pin states include:

  • Output low or high
  • Pullup or pulldown
  • Input or output enabled
  • Drive configuration

After exiting SHUTDOWN mode, the IOs are held in the previous state until released by application software setting the RELEASE bit in the SHDNIOREL register along with the matching KEY value.

When exiting SHUTDOWN, the serial wire debug (SWD) pins also remain locked until application software sets the RELEASE bit. As a result, a debug connection cannot establish when waking up from SHUTDOWN mode until the IO are released by application software.

TI debug tool - XDS110, right now supports directly debug the device wake up from SHUTDOWN mode.