SLASFD9 April   2025 TAC5301-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Electrical Characteristics
    7. 5.7  Timing Requirements: I2C Interface
    8. 5.8  Switching Characteristics: I2C Interface
    9. 5.9  Timing Requirements: TDM, I2S or LJ Interface
    10. 5.10 Switching Characteristics: TDM, I2S or LJ Interface
    11. 5.11 Timing Diagrams
    12. 5.12 Typical Charactaristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3 Input Channel Configuration
      4. 6.3.4 Output Channel Configurations
      5. 6.3.5 Reference Voltage
      6. 6.3.6 Microphone Bias
      7. 6.3.7 Signal-Chain Processing
        1. 6.3.7.1 ADC Signal-Chain
          1. 6.3.7.1.1  Programmable Channel Gain and Digital Volume Control
          2. 6.3.7.1.2  Programmable Channel Gain Calibration
          3. 6.3.7.1.3  Programmable Channel Phase Calibration
          4. 6.3.7.1.4  Programmable Digital High-Pass Filter
          5. 6.3.7.1.5  Programmable Digital Biquad Filters
          6. 6.3.7.1.6  Programmable Channel Summer and Digital Mixer
          7. 6.3.7.1.7  Configurable Digital Decimation Filters
            1. 6.3.7.1.7.1 Linear-phase filters
              1. 6.3.7.1.7.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.7.1.7.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.7.1.7.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.7.1.7.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.7.1.7.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.7.1.7.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.7.1.7.1.7 Sampling Rate: 192kHz or 176.4kHz
            2. 6.3.7.1.7.2 Low-latency Filters
              1. 6.3.7.1.7.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.1.7.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.1.7.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.1.7.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.1.7.2.5 Sampling Rate: 192kHz or 176.4kHz
            3. 6.3.7.1.7.3 Ultra-Low-Latency Filters
              1. 6.3.7.1.7.3.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.1.7.3.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.1.7.3.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.1.7.3.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.1.7.3.5 Sampling Rate: 192kHz or 176.4kHz
          8. 6.3.7.1.8  Automatic Gain Controller (AGC)
          9. 6.3.7.1.9  Voice Activity Detection (VAD)
          10. 6.3.7.1.10 Ultrasonic Activity Detection (UAD)
        2. 6.3.7.2 DAC Signal-Chain
          1. 6.3.7.2.1 Programmable Channel Gain and Digital Volume Control
          2. 6.3.7.2.2 Programmable Channel Gain Calibration
          3. 6.3.7.2.3 Programmable Digital High-Pass Filter
          4. 6.3.7.2.4 Programmable Digital Biquad Filters
          5. 6.3.7.2.5 Configurable Digital Interpolation Filters
            1. 6.3.7.2.5.1 Linear-phase filters
              1. 6.3.7.2.5.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.7.2.5.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.7.2.5.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.7.2.5.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.7.2.5.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.7.2.5.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.7.2.5.1.7 Sampling Rate: 192kHz or 176.4kHz
            2. 6.3.7.2.5.2 Low-latency Filters
              1. 6.3.7.2.5.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.2.5.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.2.5.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.2.5.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.2.5.2.5 Sampling Rate: 192kHz or 176.4kHz
            3. 6.3.7.2.5.3 Ultra-Low-Latency Filters
              1. 6.3.7.2.5.3.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.2.5.3.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.2.5.3.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.2.5.3.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.2.5.3.5 Sampling Rate 192kHz or 176.4kHz
      8. 6.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing
      9. 6.3.9 Power Tune Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Software Reset
      3. 6.4.3 Active Mode
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 General I2C Operation
        2. 6.5.1.2 I2C Single-Byte and Multiple-Byte Transfers
          1. 6.5.1.2.1 I2C Single-Byte Write
          2. 6.5.1.2.2 I2C Multiple-Byte Write
          3. 6.5.1.2.3 I2C Single-Byte Read
          4. 6.5.1.2.4 I2C Multiple-Byte Read
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
      1. 7.1.1 TAC5301-Q1_B0_P0 Registers
      2. 7.1.2 TAC5301-Q1_B0_P1 Registers
      3. 7.1.3 TAC5301-Q1_B0_P3 Registers
    2. 7.2 Programmable Coefficient Registers
      1. 7.2.1  Programmable Coefficient Registers: Page 8
      2. 7.2.2  Programmable Coefficient Registers: Page 9
      3. 7.2.3  Programmable Coefficient Registers: Page 10
      4. 7.2.4  Programmable Coefficient Registers: Page 11
      5. 7.2.5  Programmable Coefficient Registers: Page 15
      6. 7.2.6  Programmable Coefficient Registers: Page 16
      7. 7.2.7  Programmable Coefficient Registers: Page 17
      8. 7.2.8  Programmable Coefficient Registers: Page 18
      9. 7.2.9  Programmable Coefficient Registers: Page 19
      10. 7.2.10 Programmable Coefficient Registers: Page 25
      11. 7.2.11 Programmable Coefficient Registers: Page 26
      12. 7.2.12 Programmable Coefficient Registers: Page 27
      13. 7.2.13 Programmable Coefficient Registers: Page 28
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Typical Characteristics
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 IOVDD_IO_MODE for 1.8V and 1.2V Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Example
      2. 8.4.2 Layout Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Electrostatic Discharge Caution
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.1 Absolute Maximum Ratings

over the operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage AVDD to AVSS –0.3 3.9 V
Supply voltage IOVDD to IOVSS –0.3 3.9 V
Supply voltage HVDD to AVSS –0.3 14 V
Ground voltage differences Between AVSS, IOVSS, VSSA and VSS (thermal pad) –0.3 0.3 V
Analog input voltage Analog input pins voltage to AVSS –0.3 18 V
Digital input voltage Digital input pins voltage to VSS (thermal pad) –0.3 IOVDD + 0.3 V
Temperature Operating ambient, TA –40 125 °C
Junction, TJ –40 150
Storage, Tstg –65 150
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.