SLASFJ7A July   2024  – February 2026 MSPM0C1106-Q1

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Functional Block Diagram
6. 5 Device Comparison
7. 6 Pin Configuration and Functions
   1. 6.1 Pin Diagrams
   2. 6.2 Pin Attributes
      1.      10
   3. 6.3 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
      12.      23
   4. 6.4 Connections for Unused Pins
8. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
   6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
      2. 7.6.2 POR and BOR
   7. 7.7  Flash Memory Characteristics
   8. 7.8  Timing Characteristics
   9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 Low Frequency Crystal/Clock
      4. 7.9.4 High Frequency Crystal/Clock
   10. 7.10 Digital IO
       1. 7.10.1 Electrical Characteristics
       2. 7.10.2 Switching Characteristics
   11. 7.11 Analog Mux VBOOST
   12. 7.12 ADC
       1. 7.12.1 Electrical Characteristics
       2. 7.12.2 Switching Characteristics
       3. 7.12.3 Linearity Parameters
       4. 7.12.4 Typical Connection Diagram
   13. 7.13 Temperature Sensor
   14. 7.14 VREF
       1. 7.14.1 Electrical Characteristics
       2. 7.14.2 Voltage Characteristics
   15. 7.15 Comparator (COMP)
       1. 7.15.1 Comparator Electrical Characteristics
   16. 7.16 I2C
       1. 7.16.1 I2C Characteristics
       2. 7.16.2 I2C Filter
       3. 7.16.3 I2C Timing Diagram
   17. 7.17 SPI
       1. 7.17.1 SPI
       2. 7.17.2 SPI Timing Diagram
   18. 7.18 UART
   19. 7.19 TIMx
   20. 7.20 Emulation and Debug
       1. 7.20.1 SWD Timing
9. 8 Detailed Description
   1. 8.1  Overview
   2. 8.2  CPU
   3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode
   4. 8.4  Power Management Unit (PMU)
   5. 8.5  Clock Module (CKM)
   6. 8.6  DMA_B
   7. 8.7  Events
   8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
   9. 8.9  Flash Memory
   10. 8.10 SRAM
   11. 8.11 GPIO
   12. 8.12 IOMUX
   13. 8.13 ADC
   14. 8.14 Temperature Sensor
   15. 8.15 Low-Frequency Sub System (LFSS)
   16. 8.16 VREF
   17. 8.17 COMP
   18. 8.18 Security
   19. 8.19 CRC
   20. 8.20 UART
   21. 8.21 I2C
   22. 8.22 SPI
   23. 8.23 IWDT
   24. 8.24 WWDT
   25. 8.25 RTC_B
   26. 8.26 Timers (TIMx)
   27. 8.27 Device Analog Connections
   28. 8.28 Input/Output Diagrams
   29. 8.29 Serial Wire Debug Interface
   30. 8.30 DEBUGSS
   31. 8.31 Device Factory Constants
   32. 8.32 Identification
10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
       1. 9.1.1 Schematic
11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information