SLAU951 June   2025 MSPM0H3216

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Hardware Overview
    2. 2.2 Power Requirements
    3. 2.3 XDS110 Debug Probe
    4. 2.4 Measure Current Draw of the MSPM0H3216
    5. 2.5 Clocking
    6. 2.6 BoosterPack Plug-in Module Pinout
  9. 3Software
    1. 3.1 Software Development Options
    2. 3.2 Out-of-Box GUI
    3. 3.3 CCS Cloud
  10. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials (BOM)
  11. 5Additional Information
    1. 5.1 Trademarks
  12. 6Related Documentation
    1. 6.1 Supplemental Content

4.2 PCB Layout

LP-MSPM0H3216 Layer 1: Top, signal and powerFigure 4-7 Layer 1: Top, signal and power.

Layer 1: Top, signal

LP-MSPM0H3216 Layer 2: VDD Figure 4-8 Layer 2: VDD.

Layer 2: VDD

LP-MSPM0H3216 Layer 3: GND Figure 4-9 Layer 3: GND.

Layer 3: GND

LP-MSPM0H3216 Layer 4: Bottom, signal Figure 4-10 Layer 4: Bottom, signal.

Layer 4: Bottom, signal