SLAZ780 July 2026 TMS320C6410 , TMS320C6412 , TMS320C6413 , TMS320C6418 , TMS320DM640 , TMS320DM642 , TMS320DM642Q , TMS320DM643
1 Package Redesign Details
Explanation
The ZNZ and ZDK packages containing Tin-Lead (SnPb) die bumps are being phased out and replaced with completely lead-free CNZ and CDK packages containing Tin-Silver (SnAg) die bumps.
These lead-free packages (CNZ and CDK) offer datasheet equivalent electrical performance, footprint compatibility, using the same BGA map and x-y dimensions as the ZNZ and ZDK packages, respectively.
When referencing the device data sheet, use the new package designators in place of the discontiued package designators throughout the document.
See the following pages for the updated Lead-free CNZ and CDK package drawings.
| Old Package Designators | New Package Designators |
|---|---|
| ZNZ | CNZ |
| ZDK | CDK |
Reason for Discontinuance
Due to receiving an End-Of-Life notice from our supplier of a tin-lead (SnPb) bump material used in the ZNZ and ZDK packages, we are phasing out devices in the ZNZ and ZDK packages.
These ZNZ and ZDK devices have now been converted to lead-free CNZ and CDK packages, respectively.
Devices Affected
The following table describes the devices affected, the old and new package designators, and references to the device data sheet.
| Discontinued Devices | New Devices | Device Data Sheet |
|---|---|---|
| TMS320C6412AZNZxxxx | TMS320C6412ACNZxxxx | SPRS219J |
| TMS320DM640AZDKxxxx | TMS320DM640ACDKxxxx | SPRS222F |
| TMS320DM640AZNZxxxx | TMS320DM640ACNZxxxx | SPRS222F |
| TMS320DM642AZDKxxxx | TMS320DM642ACDKxxxx | SPRS200N |
| TMS320DM642AZNZxxxx | TMS320DM642ACNZxxxx | SPRS200N |
| TMS320DM643AZNZxxxx | TMS320DM643ACNZxxxx | SPRS269D |
| TS320DRA342AZDKxxxx | TS320DRA342ACDKxxxx | SPRS577 |
