SLFS022J September   1973  – February 2025 NA555 , NE555 , SA555 , SE555 , SE555M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Monostable Operation
      2. 6.3.2 Astable Operation
      3. 6.3.3 Frequency Divider
    4. 6.4 Device Functional Modes
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Missing-Pulse Detector
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Pulse-Width Modulation
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curve
      3. 7.2.3 Pulse-Position Modulation
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
        3. 7.2.3.3 Application Curve
      4. 7.2.4 Sequential Timer
        1. 7.2.4.1 Design Requirements
        2. 7.2.4.2 Detailed Design Procedure
        3. 7.2.4.3 Application Curve
    3. 7.3 Power Supply Recommendations
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) NA556, NE556, SA555, SE555 SE555 NA555, NE555 NE555 UNIT
D
(SOIC)		 FK
(LCCC)		 JG
(CDIP)		 P
(PDIP)		 PS
(SO)		 PW
(TSSOP)
8 PINS 20 PINS 8 PINS 8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 125.4 92.2 125.0 98.5 124.5 164.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 64.9 67.6 73.3 77.8 61.2 70.5 °C/W
RθJB Junction-to-board thermal resistance 73.2 66.7 114.9 61.0 79.3 104.8 °C/W
ψJT Junction-to-top characterization parameter 14.3 61.6 44.4 43.9 16.5 8.2 °C/W
ψJB Junction-to-board characterization parameter 72.1 66.5 106.6 60.3 77.8 103.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 14.2 29.3 N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.