SLLA683 July 2026 ISO6021 , ISO6041 , ISO6420 , ISO6420-Q1 , ISO6421 , ISO6421-Q1 , ISO6431 , ISO6431-Q1 , ISO6440 , ISO6440-Q1 , ISO6441 , ISO6441-Q1 , ISO6442 , ISO6442-Q1 , ISO6462 , ISO6463
Two channel digital isolators are in the narrow SOIC 8 pin package (8-D) and 3, 4 and 6 channel digital isolators are in the narrow SSOP 16 pin package (16-DBQ). The 8-D and 16-DBQ have become the traditional packages supporting 4mm and 3.7mm creepage and clearance requirements.
The new small form factor, narrow SSOP, DFB family is used in the latest digital isolator families in addition to the traditional packages. DFB supports 4mm creepage and clearance while using 0.5mm pitch pins to significantly reduce the Y dimension along the isolation barrier of the packages.