SLLSF86D May   2018  – August 2026 ISOW1412 , ISOW1432

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Supply Current Characteristics at VISOOUT = 3.3 V
    11. 6.11 Supply Current Characteristics at  VISOOUT = 5 V
    12. 6.12 Switching Characteristics at VISOOUT = 3.3 V
    13. 6.13 Switching Characteristics at VISOOUT = 5 V
    14. 6.14 Insulation Characteristics Curves
    15. 6.15 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Power Isolation
    3. 8.3 Signal Isolation
    4. 8.4 RS-485
    5. 8.5 Functional Block Diagram
    6. 8.6 Feature Description
      1. 8.6.1 Power-Up and Power-Down Behavior
      2. 8.6.2 Protection Features
      3. 8.6.3 Failsafe Receiver
      4. 8.6.4 Glitch-Free Power Up and Power Down
    7. 8.7 Device Functional Modes
    8. 8.8 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Data Rate, Bus Length and Bus Loading
        2. 9.2.2.2 Stub Length
      3. 9.2.3 Insulation Lifetime
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

8.3 Signal Isolation

The integrated signal isolation channels employ an ON-OFF keying (OOK) modulation scheme to transmit the digital data across a silicon-dioxide based isolation barrier. The transmitter sends a high frequency carrier across the barrier to represent one state and sends no signal to represent the other state. The receiver demodulates the signal after signal conditioning and produces the output through a buffer stage. The signal-isolation channels incorporate advanced circuit techniques to maximize the CMTI performance and minimize the radiated emissions from the high frequency carrier and IO buffer switching. Figure 8-2 shows a functional block diagram of a typical signal isolation channel.

To keep any noise coupling from power converter away from signal path, power supplies on side1 for power converter (VDD) and signal path(VIO) are kept separate. Similarly on side2, power converter output (VISOOUT) needs to be connected to power supply for RS-485 (VISOIN) externally on PCB. For more details, refer to Layout guidelines section.