SLLSF86D May   2018  – August 2026 ISOW1412 , ISOW1432

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Supply Current Characteristics at VISOOUT = 3.3 V
    11. 6.11 Supply Current Characteristics at  VISOOUT = 5 V
    12. 6.12 Switching Characteristics at VISOOUT = 3.3 V
    13. 6.13 Switching Characteristics at VISOOUT = 5 V
    14. 6.14 Insulation Characteristics Curves
    15. 6.15 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Power Isolation
    3. 8.3 Signal Isolation
    4. 8.4 RS-485
    5. 8.5 Functional Block Diagram
    6. 8.6 Feature Description
      1. 8.6.1 Power-Up and Power-Down Behavior
      2. 8.6.2 Protection Features
      3. 8.6.3 Failsafe Receiver
      4. 8.6.4 Glitch-Free Power Up and Power Down
    7. 8.7 Device Functional Modes
    8. 8.8 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Data Rate, Bus Length and Bus Loading
        2. 9.2.2.2 Stub Length
      3. 9.2.3 Insulation Lifetime
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) ISOW14x2 UNIT
DFM
20 PINS
RθJA Junction-to-ambient thermal resistance 68.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20.9 °C/W
RθJB Junction-to-board thermal resistance 44.8 °C/W
ΨJT Junction-to-top characterization parameter 13 °C/W
ΨJB Junction-to-board characterization parameter 44 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance -- °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.