SLOA101B August   2002  – May 2016 SN55HVD233-SEP , SN65HVDA1040A-Q1 , SN65HVDA1050A-Q1 , SN65HVDA540-5-Q1 , SN65HVDA540-Q1 , SN65HVDA541-5-Q1 , SN65HVDA541-Q1 , SN65HVDA542-5-Q1 , SN65HVDA542-Q1

 

  1.   Introduction to the Controller Area Network (CAN)
    1.     Trademarks
    2. 1 Introduction
    3. 2 The CAN Standard
    4. 3 Standard CAN or Extended CAN
      1. 3.1 The Bit Fields of Standard CAN and Extended CAN
        1. 3.1.1 Standard CAN
        2. 3.1.2 Extended CAN
    5. 4 A CAN Message
      1. 4.1 Arbitration
      2. 4.2 Message Types
        1. 4.2.1 The Data Frame
        2. 4.2.2 The Remote Frame
        3. 4.2.3 The Error Frame
        4. 4.2.4 The Overload Frame
      3. 4.3 A Valid Frame
      4. 4.4 Error Checking and Fault Confinement
    6. 5 The CAN Bus
      1. 5.1 CAN Transceiver Features
        1. 5.1.1  3.3-V Supply Voltage
        2. 5.1.2  ESD Protection
        3. 5.1.3  Common-Mode Voltage Operating Range
        4. 5.1.4  Common-Mode Noise Rejection
        5. 5.1.5  Controlled Driver Output Transition Times
        6. 5.1.6  Low-Current Bus Monitor, Standby and Sleep Modes
        7. 5.1.7  Bus Pin Short-Circuit Protection
        8. 5.1.8  Thermal Shutdown Protection
        9. 5.1.9  Bus Input Impedance
        10. 5.1.10 Glitch-Free Power Up and Power Down
        11. 5.1.11 Unpowered Node Protection
        12. 5.1.12 Reference Voltage
        13. 5.1.13 V-Split
        14. 5.1.14 Loopback
        15. 5.1.15 Autobaud Loopback
      2. 5.2 CAN Transceiver Selection Guide
    7. 6 Conclusion
    8. 7 Additional Reading
  2.   Revision History

5.1.2 ESD Protection

Static charge is an unbalanced electrical charge at rest, typically created by the physical contact of different materials. One surface gains electrons, whereas the other surface loses electrons. This results in an unbalanced electrical condition known as a static charge. When a static charge moves from one surface to another, it is referred to as an electrostatic discharge (ESD). It can occur only when the voltage differential between the two surfaces is sufficiently high to break down the dielectric strength of the medium separating the two surfaces.

ESD can occur in any one of four ways: a charged body can touch an integrated circuit (IC), a charged IC can touch a grounded surface, a charged machine can touch an IC, or an electrostatic field can induce a voltage across a dielectric sufficient to break it down.

The main threat of ESD damage occurs during the assembly and manufacturing of circuits. After assembly and installation, the main protection required for the bus pins is surge protection.