SLUSFG2C September   2024  – June 2025 TPS6286A06 , TPS6286A08 , TPS6286A10 , TPS6286B08 , TPS6286B10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Rating
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Save Mode (PFM)
      2. 7.3.2 Forced PWM Mode
      3. 7.3.3 Low Dropout Operation (100% Duty Cycle)
      4. 7.3.4 Soft Start
      5. 7.3.5 Switch Current Limit and HICCUP Short-Circuit Protection
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Thermal Warning and Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable (EN)
      2. 7.4.2 Output Discharge
      3. 7.4.3 Power Good (PG)
      4. 7.4.4 Voltage Setting and Mode Selection (VSET/MODE), TPS6286Axx Devices
      5. 7.4.5 Start-Up Output Voltage for TPS6286Bxx Devices
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 7.5.3 HS Mode Protocol
      4. 7.5.4 I2C Update Sequence
      5. 7.5.5 I2C Register Reset
  9. 8 Register Map
    1. 8.1 Target Address Byte
    2. 8.2 Register Address Byte
    3. 8.3 VOUT Register
    4. 8.4 CONTROL Register
    5. 8.5 STATUS Register
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Setting the Output Voltage
        3. 9.2.2.3 Output Filter Design
        4. 9.2.2.4 Inductor Selection
        5. 9.2.2.5 Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS6286Axx / TPS6286Bxx UNIT
JEDEC 51-7 TPS6286AxxEVM-050 / TPS6286B10EVM-049
13 PINS 13 PINS
RθJA Junction-to-ambient thermal resistance 71.2 43.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.3 n/a(2) °C/W
RθJB Junction-to-board thermal resistance 16.6 n/a(2) °C/W
ΨJT Junction-to-top characterization parameter 1.7 6.9 °C/W
ΨJB Junction-to-board characterization parameter 16.6 10.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Not applicable to an EVM.