SLUUD96 February   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Input and Output Connections
  8. 3Implementation Results
    1. 3.1 Test Setup and Results
      1. 3.1.1 Start-Up Procedure
      2. 3.1.2 Load Transient Response
      3. 3.1.3 Start-Up
      4. 3.1.4 Shutdown
      5. 3.1.5 Output Voltage Ripple
    2. 3.2 Output Voltage Setpoint
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Reference

4.2 Layout

Figure 4-2, Figure 4-3, and Figure 4-4 show the board layout for the TPS542025EVM. The top layer contains the main power traces for VIN, VOUT, and ground. Connections for the pins of the TPS542025 and a large area filled with ground are also on the top layer. Most of the signal traces are also located on the top side. The input decoupling capacitors C2, C3, and C4 are located as close to the IC as possible. The input and output connectors, test points, and all of the components are located on the top side. The bottom layer is a ground plane along with the signal ground copper fill and the feedback trace from the point of regulation to the top of the resistor divider network. Both the top layer and bottom layer use 2oz copper thickness.

TPS542025EVM TPS542025EVM Top Assembly Figure 4-2 TPS542025EVM Top Assembly
TPS542025EVM TPS542025EVM Top Layer Figure 4-3 TPS542025EVM Top Layer
TPS542025EVM TPS542025EVM Bottom Layer Figure 4-4 TPS542025EVM Bottom Layer