SLUUDJ2 May   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 General Usage Information
  7. 3Implementation Results
    1. 3.1 Test Setup Diagrams
      1. 3.1.1 S-Parameter Test Setup
      2. 3.1.2 Noise Figure Test Setup
      3. 3.1.3 Two-Tone OIP3 Test Setup
  8. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layers
      1. 4.2.1 Stack-Up and Material
    3. 4.3 TRF0108SP/SEP-EVM Bill of Material
  9. 5Additional Information
    1. 5.1 Trademarks
  10. 6Related Documentation

4.2.1 Stack-Up and Material

The TRF0108SP/SEP-EVM is a 67-mil, 4-layer board whose material type is Isola® 370HR. The top layer routes the power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground layer. The signal trace impedance is targeted at 50Ω. The bottom two are primarily ground layers.

TRF0108SP-EVM TRF0108SEP-EVM TRF0108SP/SEP-EVM Stack-Up (Units in Mils)Figure 4-6 TRF0108SP/SEP-EVM Stack-Up (Units in Mils)