SLVAEB1A March   2020  – October 2021 TLV62568 , TLV62569 , TLV62585

 

  1.   Trademarks
  2. 1Introduction
  3. 2Describing the TLV62569 Package Technologies: SOT23-5, SOT23-6, and SOT563
  4. 3Understanding Thermal Performance and Junction Temperature Estimation
    1. 3.1 Understanding Thermal Performance
    2. 3.2 Estimating Junction Temperature
  5. 4Measurement Setup and Test Results
    1. 4.1 Efficiency Measurements
    2. 4.2 Thermal Measurements
  6. 5Thermal Performance Analysis for SOT23-5, SOT23-6, and SOT563 Packages
    1. 5.1 Comparing SOT563 (DRL) and SOT23-6 (DDC)
    2. 5.2 Comparing SOT23-6 (DDC) and SOT23-5 (DBV)
    3. 5.3 Comparing SOT563 (DRL) and SOT23-5 (DBV)
  7. 6Summary
  8. 7References
  9. 8Revision History

5 Thermal Performance Analysis for SOT23-5, SOT23-6, and SOT563 Packages

Measurements done in the previous section show the performance of a same device TLV62569, with a same die area in three different packages. For example, the measurements show just the difference in packages, excluding impact of the standalone die. This section focuses on analyzing the impact of each package on the performance of the device and understanding which package is more suitable to address a specific key requirement of the end equipment.