SLVAEB1A March   2020  – October 2021 TLV62568 , TLV62569 , TLV62585

 

  1.   Trademarks
  2. 1Introduction
  3. 2Describing the TLV62569 Package Technologies: SOT23-5, SOT23-6, and SOT563
  4. 3Understanding Thermal Performance and Junction Temperature Estimation
    1. 3.1 Understanding Thermal Performance
    2. 3.2 Estimating Junction Temperature
  5. 4Measurement Setup and Test Results
    1. 4.1 Efficiency Measurements
    2. 4.2 Thermal Measurements
  6. 5Thermal Performance Analysis for SOT23-5, SOT23-6, and SOT563 Packages
    1. 5.1 Comparing SOT563 (DRL) and SOT23-6 (DDC)
    2. 5.2 Comparing SOT23-6 (DDC) and SOT23-5 (DBV)
    3. 5.3 Comparing SOT563 (DRL) and SOT23-5 (DBV)
  7. 6Summary
  8. 7References
  9. 8Revision History

4 Measurement Setup and Test Results

This section shows a comparison of the performances of the TLV62569 which has the same die area in the three packages: SOT23-5 (DBV), SOT23-6 (DDC), and SOT563 (DRL).

For analyzing the thermal performance across the three different packages, the efficiency is measured on the three different Evaluation Modules (EVM) shown in Table 4-1. The case temperature is measured with a thermal camera as shown in Figure 4-1 and the junction temperature is estimated using Equation 1 as explained in the previous section.

GUID-1243E0A8-AC05-42EE-8BC8-4615C8B04292-low.gifFigure 4-1 Case Temperature Measurement with a Thermal Camera
Table 4-1 EVMs Used for Measurements
SOT23-5 PACKAGE (DBV)
TLV62569EVM-789		 SOT23-6 PACKAGE (DDC)
TLV62569EVM-884		 SOT563 PACKAGE (DRL)
TLV62569EVM-860
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