Compared to SOT563 (DRL), the SOT23-5 (DBV) package seems to have a better thermal performance with a lower case temperature, with T_case = 65°C, than SOT563, T_case = 71°C (see Table 4-4). However, SOT23-5 package has the highest junction temperature, T_junction = 80°C, for the same operating conditions over the three packages. The system designer has to be careful and take in account this aspect when deciding upon which package option to choose. With the SOT563 package, the junction temperature is almost equal to the case temperature, (lower than for SOT23-5 package), which allows easier control of junction temperature. This aspect is reflected in the ψ_JT parameter of the TLV62569 2-A High Efficiency Synchronous Buck Converter in SOT Package Data Sheet.

The SOT563 package also offers higher light load efficiency than SOT23-5, thanks to FCOL technology where there are no losses through the internal bond wires. The third biggest advantage of the SOT563 (DRL) over the SOT23-5 (DBV) and SOT23-6 (DBV) is the package size (-65%). SOT563 (DRL) is a more recent package technology innovation that allows a smaller package size (see Figure 5-1), higher power density, and improved thermal dissipation.

Figure 5-1 SOT23 and SOT563 Package Size

For applications like Motor Drives Control Modules where thermal performance is a key concern, the SOT23-6 (DDC) package offers the lower junction and case temperature. For applications like Industrial PC, Security Cameras, or SSD Memory Modules where size and temperature are critical for the system design SOT563 (DRL) offers the smallest IC size, 65% smaller than SOT23 (DBV, DDC) with very good thermal performance.