SLVAEX0 October   2020 TPS1H000-Q1 , TPS1H100-Q1 , TPS1H200A-Q1 , TPS1HA08-Q1 , TPS1HB16-Q1 , TPS1HB50-Q1 , TPS2HB16-Q1 , TPS2HB50-Q1 , TPS4H000-Q1 , TPS4H160-Q1

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Normal Operation Diagnostics
    1. 2.1 Configuring Diagnostics With SEL/SELx Pin
      1. 2.1.1 Diagnostics Select Pin: SEL1
      2. 2.1.2 Diagnostics Select Pin: SELx
    2. 2.2 Operating Current Measurements Using the SNS/CS Pin
      1. 2.2.1 Internal/External Factor: Load Current Through Device
      2. 2.2.2 External Factor: Analog-to-Digital Converter (ADC)
      3. 2.2.3 External Factor: Probe Ground Termination
      4. 2.2.4 External Factor: Component Tolerances
    3. 2.3 Device Temperature on the Sense (SNS) Pin
  5. 3Fault State Diagnostics
    1. 3.1 Fault Behavior Configurations: Latch/THER/Delay Pin
      1. 3.1.1 Latch Pin
      2. 3.1.2 THER Pin
      3. 3.1.3 Delay Pin
    2. 3.2 Open Load Fault
    3. 3.3 Short to Battery Fault
    4. 3.4 Thermal Shutdown
    5. 3.5 Loss of Ground or Power Supply
    6. 3.6 Summary
  6. 4References

3 Fault State Diagnostics

During normal operation, the device will monitor for fault events that can occur. These faults can include loss of battery, a disconnected load, or the output becoming shorted to ground. Using some status pins, the device can report these faults once they are detected and a procedure can be followed to distinguish, diagnose, and reset the device to ensure the fault does not continue to be a problem. These faults can be detected and distinguished by the device for the user to understand the behavior and take the appropriate measures to counteract or remove the problem that is resulting in the fault. By enabling these reports using the diagnostics enable pin DIAG_EN, the fault event will be reported either on the /ST, CS, or /FLT pins. The sections that follow will describe each fault, the conditions that cause them well as how to distinguish them.