SLVAEX0 October   2020 TPS1H000-Q1 , TPS1H100-Q1 , TPS1H200A-Q1 , TPS1HA08-Q1 , TPS1HB16-Q1 , TPS1HB50-Q1 , TPS2HB16-Q1 , TPS2HB50-Q1 , TPS4H000-Q1 , TPS4H160-Q1

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Normal Operation Diagnostics
    1. 2.1 Configuring Diagnostics With SEL/SELx Pin
      1. 2.1.1 Diagnostics Select Pin: SEL1
      2. 2.1.2 Diagnostics Select Pin: SELx
    2. 2.2 Operating Current Measurements Using the SNS/CS Pin
      1. 2.2.1 Internal/External Factor: Load Current Through Device
      2. 2.2.2 External Factor: Analog-to-Digital Converter (ADC)
      3. 2.2.3 External Factor: Probe Ground Termination
      4. 2.2.4 External Factor: Component Tolerances
    3. 2.3 Device Temperature on the Sense (SNS) Pin
  5. 3Fault State Diagnostics
    1. 3.1 Fault Behavior Configurations: Latch/THER/Delay Pin
      1. 3.1.1 Latch Pin
      2. 3.1.2 THER Pin
      3. 3.1.3 Delay Pin
    2. 3.2 Open Load Fault
    3. 3.3 Short to Battery Fault
    4. 3.4 Thermal Shutdown
    5. 3.5 Loss of Ground or Power Supply
    6. 3.6 Summary
  6. 4References

3.4 Thermal Shutdown

There are two types of faults that detail the smart devices thermal behavior. As the device dissipates power, the device’s junction temperature will increase. The first thermal fault could occur is absolute thermal shutdown and happens when the device’s junction temperature exceeds thermal shutdown temperature, TABS. The second is known as relative thermal shutdown or thermal swing. Thermal swing occurs when the junction temperature of the main FET increases a set amount above the controller.

In both cases, the switch is disabled. The device will attempt to retry re-enable when the junction temperature is below the shutdown temperature hysteresis but also lowers the output current.

GUID-5606B9ED-E9E9-47E9-87BC-BEDD1152E265-low.png Figure 3-3 Thermal Behavior in TPS1H100-Q1