SLVSAJ4E September   2010  – June 2026 TPS723-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Dissipation Ratings (legacy chip)
    5. 5.5 Thermal Information (new chip)
    6. 5.6 Electrical Characteristics
  7. 6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Current Limit
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Output Pullup
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 NR and Programmable Soft-Start
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistor Selection
      2. 8.1.2 Recommended Capacitor Types
      3. 8.1.3 Input and Output Capacitor Selection
      4. 8.1.4 Reverse Current
      5. 8.1.5 Feed-Forward Capacitor (CFF)
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Output Noise
      2. 8.2.2 Design Requirements
      3. 8.2.3 Power-Supply Rejection
      4. 8.2.4 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Spice Models
      2. 9.1.2 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.1.4 Reverse Current

Excessive reverse current can damage this device. Reverse current flows through the intrinsic body diode of the pass transistor instead of the normal conducting channel. At high magnitudes, this current flow degrades the long-term reliability of the device.

Conditions where reverse current can occur are outlined in this section, all of which can exceed the absolute maximum rating of VOUT ≥ VIN - 0.3V.

  • If the device has a large COUT and the input supply collapses with little or no load current
  • The output is biased when the input supply is not established
  • The output is biased below the input supply

If reverse current flow is expected in the application, external protection is recommended to protect the device. Reverse current is not limited in the device, so external limiting is required if extended reverse voltage operation is anticipated.

Figure 8-1 shows one approach for protecting the device.

TPS723-Q1 Example Circuit for Reverse Current Protection Using a Schottky Diode Figure 8-1 Example Circuit for Reverse Current Protection Using a Schottky Diode