SLVSAJ4E September   2010  – June 2026 TPS723-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Dissipation Ratings (legacy chip)
    5. 5.5 Thermal Information (new chip)
    6. 5.6 Electrical Characteristics
  7. 6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Current Limit
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Output Pullup
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 NR and Programmable Soft-Start
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistor Selection
      2. 8.1.2 Recommended Capacitor Types
      3. 8.1.3 Input and Output Capacitor Selection
      4. 8.1.4 Reverse Current
      5. 8.1.5 Feed-Forward Capacitor (CFF)
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Output Noise
      2. 8.2.2 Design Requirements
      3. 8.2.3 Power-Supply Rejection
      4. 8.2.4 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Spice Models
      2. 9.1.2 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Best Design Practices

Do place at least one 2.2µF ceramic capacitor as close as possible to the OUT pin of the regulator.

Do not place the output capacitor more than 10mm away from the regulator.

Do connect a 0.1μF to 2.2μF low ESR capacitor across the IN pin and GND input of the regulator.

Do not exceed the absolute maximum ratings.