SLVSAJ4E September   2010  – June 2026 TPS723-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Dissipation Ratings (legacy chip)
    5. 5.5 Thermal Information (new chip)
    6. 5.6 Electrical Characteristics
  7. 6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Current Limit
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Output Pullup
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 NR and Programmable Soft-Start
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistor Selection
      2. 8.1.2 Recommended Capacitor Types
      3. 8.1.3 Input and Output Capacitor Selection
      4. 8.1.4 Reverse Current
      5. 8.1.5 Feed-Forward Capacitor (CFF)
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Output Noise
      2. 8.2.2 Design Requirements
      3. 8.2.3 Power-Supply Rejection
      4. 8.2.4 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Spice Models
      2. 9.1.2 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.2.4 Application Curves

TPS723-Q1 TPS72325Q1 Power-Up, Power-Down (Legacy Device)Figure 8-3 TPS72325Q1 Power-Up, Power-Down (Legacy Device)
TPS723-Q1 PSRR vs Frequency (Legacy Device)Figure 8-5 PSRR vs Frequency (Legacy Device)
TPS723-Q1 Start-up Response (VIN and EN Tied Together) (New Device)
 IOUT = 200mA, CNR = 10nF
Figure 8-7 Start-up Response (VIN and EN Tied Together) (New Device)
TPS723-Q1 PSRR vs IOUT (New Device)
VIN = –3.0V
Figure 8-9 PSRR vs IOUT (New Device)
TPS723-Q1 TPS72325Q1 Output Noise vs Time (Legacy Device)
 
Figure 8-4 TPS72325Q1 Output Noise vs Time (Legacy Device)
TPS723-Q1 Start-up Response (VIN Ramping Before EN) (New Device)
 IOUT = 200mA
Figure 8-6 Start-up Response (VIN Ramping Before EN) (New Device)
TPS723-Q1 Total Noise vs IOUT (10Hz to 100kHz) (New Device)
VIN = –3.0V
Figure 8-8 Total Noise vs IOUT (10Hz to 100kHz) (New Device)