SLVSAJ4E September   2010  – June 2026 TPS723-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Dissipation Ratings (legacy chip)
    5. 5.5 Thermal Information (new chip)
    6. 5.6 Electrical Characteristics
  7. Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Current Limit
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Output Pullup
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 NR and Programmable Soft-Start
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistor Selection
      2. 8.1.2 Recommended Capacitor Types
      3. 8.1.3 Input and Output Capacitor Selection
      4. 8.1.4 Reverse Current
      5. 8.1.5 Feed-Forward Capacitor (CFF)
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Output Noise
      2. 8.2.2 Design Requirements
      3. 8.2.3 Power-Supply Rejection
      4. 8.2.4 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Spice Models
      2. 9.1.2 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Input and Output Capacitor Selection

For new chip: The TPS723-Q1 (new chip) requires an output capacitor of 2.2µF or larger (1.0µF or larger capacitance) for stability and an equivalent series resistance (ESR) between 0.0Ω and 0.5Ω. For best transient performance, use X5R- and X7R-type ceramic capacitors because these capacitors have minimal variation in value and ESR over temperature. When choosing a capacitor for a specific application, be mindful of the DC bias characteristics for the capacitor. Higher output voltages cause a significant derating of the capacitor.

For new chip: Although an input capacitor is not required for stability, good analog design practice is to connect a capacitor from IN to GND. Some input supplies have a high impedance, thus placing the input capacitor on the input supply helps reduce the input impedance. This capacitor counteracts reactive input sources and improves transient response, input ripple, and PSRR. If the input supply has a high impedance over a large range of frequencies, several input capacitors can be used in parallel to lower the impedance over frequency. Use a higher-value capacitor if large, fast, rise-time load transients are anticipated, or if the device is located several inches from the input power source.

For legacy chip: Appropriate input and output capacitors should be used for the intended application. The TPS723-Q1 (legacy chip) only requires a 2.2μF ceramic output capacitor to be used for stable operation. Both the capacitor value and equivalent series resistance (ESR) affect stability, output noise, PSRR, and transient response. For typical applications, a 2.2μF ceramic output capacitor located close to the regulator is sufficient.