SLVSCP3D January   2015  – November 2025 TPS7B4253-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Short Circuit and Overcurrent Protection
      2. 6.3.2 Integrated Inductive Clamp Protection
      3. 6.3.3 OUT Short to Battery and Reverse Polarity Protection
      4. 6.3.4 Undervoltage Shutdown
      5. 6.3.5 Thermal Protection
      6. 6.3.6 Regulated Output (OUT)
      7. 6.3.7 Enable (EN)
      8. 6.3.8 Adjustable Output Voltage (FB and ADJ)
        1. 6.3.8.1 OUT Voltage Equal to the Reference Voltage
        2. 6.3.8.2 OUT Voltage Higher Than Reference Voltage
        3. 6.3.8.3 Output Voltage Lower Than Reference Voltage
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operation With VIN < 4V
      2. 6.4.2 Operation With EN Control
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Application With Output Voltage Equal to the Reference Voltage
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Input Capacitor
          2. 7.2.1.2.2 Output Capacitor
        3. 7.2.1.3 Application Curve
      2. 7.2.2 High-Side Switch Configuration
      3. 7.2.3 High Accuracy LDO
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Power Dissipation and Thermal Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

5.4 Thermal Information

THERMAL METRIC(1) TPS7B4253-Q1 UNIT
DDA (SO PowerPAD) PWP (HTSSOP)
8 PINS 20 PINS
ASO: ASE(2) ASO: FMX(2)
RθJA Junction-to-ambient thermal resistance 45.4 42.6 45.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.1 57.5 29.2 °C/W
RθJB Junction-to-board thermal resistance 27 17.8 24.7 °C/W
ψJT Junction-to-top characterization parameter 8.2 5.6 1.3 °C/W
ψJB Junction-to-board characterization parameter 26.9 17.9 24.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.4 7.5 3.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) See nomenclature table for more information regarding ASO.