SLVSDR2C November   2018  â€“ March 2025 ADC12DJ3200QML-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: DC Specifications
    6. 5.6  Electrical Characteristics: Power Consumption
    7. 5.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 5.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 5.9  Timing Requirements
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagrams
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Inputs
        1. 6.3.1.1 Analog Input Protection
        2. 6.3.1.2 Full-Scale Voltage (VFS) Adjustment
        3. 6.3.1.3 Analog Input Offset Adjust
      2. 6.3.2 ADC Core
        1. 6.3.2.1 ADC Theory of Operation
        2. 6.3.2.2 ADC Core Calibration
        3. 6.3.2.3 ADC Overrange Detection
        4. 6.3.2.4 Code Error Rate (CER)
      3. 6.3.3 Timestamp
      4. 6.3.4 Clocking
        1. 6.3.4.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 6.3.4.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 6.3.4.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 6.3.4.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 6.3.4.3.2 Automatic SYSREF Calibration
      5. 6.3.5 Digital Down Converters (Dual-Channel Mode Only)
        1. 6.3.5.1 Numerically-Controlled Oscillator and Complex Mixer
          1. 6.3.5.1.1 NCO Fast Frequency Hopping (FFH)
          2. 6.3.5.1.2 NCO Selection
          3. 6.3.5.1.3 Basic NCO Frequency Setting Mode
          4. 6.3.5.1.4 Rational NCO Frequency Setting Mode
          5. 6.3.5.1.5 NCO Phase Offset Setting
          6. 6.3.5.1.6 NCO Phase Synchronization
        2. 6.3.5.2 Decimation Filters
        3. 6.3.5.3 Output Data Format
        4. 6.3.5.4 Decimation Settings
          1. 6.3.5.4.1 Decimation Factor
          2. 6.3.5.4.2 DDC Gain Boost
      6. 6.3.6 JESD204B Interface
        1. 6.3.6.1 Transport Layer
        2. 6.3.6.2 Scrambler
        3. 6.3.6.3 Link Layer
          1. 6.3.6.3.1 Code Group Synchronization (CGS)
          2. 6.3.6.3.2 Initial Lane Alignment Sequence (ILAS)
          3. 6.3.6.3.3 8b, 10b Encoding
          4. 6.3.6.3.4 Frame and Multiframe Monitoring
        4. 6.3.6.4 Physical Layer
          1. 6.3.6.4.1 SerDes Pre-Emphasis
        5. 6.3.6.5 JESD204B Enable
        6. 6.3.6.6 Multi-Device Synchronization and Deterministic Latency
        7. 6.3.6.7 Operation in Subclass 0 Systems
      7. 6.3.7 Alarm Monitoring
        1. 6.3.7.1 NCO Upset Detection
        2. 6.3.7.2 Clock Upset Detection
      8. 6.3.8 Temperature Monitoring Diode
      9. 6.3.9 Analog Reference Voltage
    4. 6.4 Device Functional Modes
      1. 6.4.1 Dual-Channel Mode
      2. 6.4.2 Single-Channel Mode (DES Mode)
      3. 6.4.3 JESD204B Modes
        1. 6.4.3.1 JESD204B Output Data Formats
        2. 6.4.3.2 Dual DDC and Redundant Data Mode
      4. 6.4.4 Power-Down Modes
      5. 6.4.5 Test Modes
        1. 6.4.5.1 Serializer Test-Mode Details
        2. 6.4.5.2 PRBS Test Modes
        3. 6.4.5.3 Ramp Test Mode
        4. 6.4.5.4 Short and Long Transport Test Mode
          1. 6.4.5.4.1 Short Transport Test Pattern
          2. 6.4.5.4.2 Long Transport Test Pattern
        5. 6.4.5.5 D21.5 Test Mode
        6. 6.4.5.6 K28.5 Test Mode
        7. 6.4.5.7 Repeated ILA Test Mode
        8. 6.4.5.8 Modified RPAT Test Mode
      6. 6.4.6 Calibration Modes and Trimming
        1. 6.4.6.1 Foreground Calibration Mode
        2. 6.4.6.2 Background Calibration Mode
        3. 6.4.6.3 Low-Power Background Calibration (LPBG) Mode
      7. 6.4.7 Offset Calibration
      8. 6.4.8 Trimming
      9. 6.4.9 Offset Filtering
    5. 6.5 Programming
      1. 6.5.1 Using the Serial Interface
        1. 6.5.1.1 SCS
        2. 6.5.1.2 SCLK
        3. 6.5.1.3 SDI
        4. 6.5.1.4 SDO
        5. 6.5.1.5 Streaming Mode
    6. 6.6 Register Maps
      1. 6.6.1 Register Descriptions
      2. 6.6.2 SYSREF Calibration Registers (0x2B0 to 0x2BF)
      3. 6.6.3 Alarm Registers (0x2C0 to 0x2C2)
  8. 7 Application Information Disclaimer
    1. 7.1 Application Information
      1. 7.1.1 Analog Inputs
      2. 7.1.2 Analog Input Bandwidth
      3. 7.1.3 Clocking
      4. 7.1.4 Radiation Environment Recommendations
        1. 7.1.4.1 Single Event Latch-Up (SEL)
        2. 7.1.4.2 Single Event Functional Interrupt (SEFI)
        3. 7.1.4.3 Single Event Upset (SEU)
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 RF Input Signal Path
        2. 7.2.2.2 Calculating Values of AC-Coupling Capacitors
      3. 7.2.3 Application Curves
    3. 7.3 Initialization Set Up
    4.     Power Supply Recommendations
      1. 7.4.1 Power Sequencing
    5. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Third-Party Products Disclaimer
    4. 8.4 Receiving Notification of Documentation Updates
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision B (May 2021) to Revision C (March 2025)

  • Changed the Device Information table to Package Information tableGo
  • Changed the description of all DAx+, DAx-, DBx+ and DBx- pins in the Pin Functions tableGo
  • Added Note 1 to the Pin Functions tableGo
  • Updated Note 1 in the Recommended Operating Conditions Go
  • Changed values in the Thermal Information Go
  • Added Note 3 to the Thermal Information Go

Changes from Revision A (May 2019) to Revision B (March 2021)

  • Added package CCGA (196) to the Device Information tableGo
  • Added package CCGA (196) to the Pin Configuration and Functions Go
  • Added package CCGA (196) to the Thermal Information tableGo

Changes from Revision * (November 2018) to Revision A (May 2019)