SLVSE16E May   2019  – September 2026 TPS1HB08-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1. 5.1 Recommended Connections for Unused Pins
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Protection Mechanisms
        1. 8.3.1.1 Thermal Shutdown
        2. 8.3.1.2 Current Limit
          1. 8.3.1.2.1 Current Limit Foldback
          2. 8.3.1.2.2 Programmable Current Limit
          3. 8.3.1.2.3 Undervoltage Lockout (UVLO)
          4. 8.3.1.2.4 VBB During Short-to-Ground
        3. 8.3.1.3 Voltage Transients
          1. 8.3.1.3.1 Load Dump
          2. 8.3.1.3.2 Driving Inductive Loads
        4. 8.3.1.4 Reverse Battery
        5. 8.3.1.5 Fault Event – Timing Diagrams - Version A and B
        6. 8.3.1.6 Fault Event – Timing Diagrams - Version F
      2. 8.3.2 Diagnostic Mechanisms
        1. 8.3.2.1 VOUT Short-to-Battery and Open-Load
          1. 8.3.2.1.1 Detection With Switch Enabled
          2. 8.3.2.1.2 Detection With Switch Disabled
        2. 8.3.2.2 SNS Output
          1. 8.3.2.2.1 RSNS Value
            1. 8.3.2.2.1.1 High Accuracy Load Current Sense
            2. 8.3.2.2.1.2 SNS Output Filter
        3. 8.3.2.3 Fault Indication and SNS Mux
        4. 8.3.2.4 Resistor Sharing
        5. 8.3.2.5 High-Frequency, Low Duty-Cycle Current Sensing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Off
      2. 8.4.2 Standby
      3. 8.4.3 Diagnostic
      4. 8.4.4 Standby Delay
      5. 8.4.5 Active
      6. 8.4.6 Fault
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Ground Protection Network
      2. 9.1.2 Interface With Microcontroller
      3. 9.1.3 I/O Protection
      4. 9.1.4 Inverse Current
      5. 9.1.5 Loss of GND
      6. 9.1.6 Automotive Standards
        1. 9.1.6.1 ISO7637-2
        2. 9.1.6.2 TPS1HB08-Q1 AEC-Q100-012 Short-Circuit Reliability
      7. 9.1.7 Interference on Device Pins
      8. 9.1.8 Thermal Information
    2. 9.2 Typical Application: Resistive Heater Loads
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Thermal Considerations
        2. 9.2.2.2 RILIM Calculation
        3. 9.2.2.3 Diagnostics
          1. 9.2.2.3.1 Selecting the RISNS Value
    3. 9.3 Typical Application: Headlight Bulb Loads
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

9.1.8 Thermal Information

When outputting current, the TPS1HB08-Q1 heats up due to the power dissipation. The transient thermal impedance curve can be used to determine the device temperature during a pulse of a given length. This ZθJA value corresponds to a JEDEC standard 2s2p thermal test PCB with thermal vias.

TPS1HB08-Q1 TPS1HB08-Q1 Transient Thermal ImpedanceFigure 9-2 TPS1HB08-Q1 Transient Thermal Impedance