SLVSFG1A January   2021  – May 2021 TPS2116

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Truth Table
      2. 7.3.2 Soft Start
      3. 7.3.3 Status Indication
      4. 7.3.4 Reverse Current Blocking
    4. 7.4 VINx Collapse Rate
    5. 7.5 Output Voltage Drop
    6. 7.6 Device Functional Modes
      1. 7.6.1 Priority/Manual Mode
        1. 7.6.1.1 Priority Switching
        2. 7.6.1.2 Manual Switching
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS2116 UNIT
DRL (SOT)
8-PINS
RθJA Junction-to-ambient thermal resistance 111.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 19.4 °C/W
RθJB Junction-to-board thermal resistance 35.8 °C/W
ΨJT Junction-to-top characterization parameter 1.2 °C/W
ΨJB Junction-to-board characterization parameter 19.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.