SLVSGL4A September   2023  – May 2026 TPS1HTC30-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1. 5.1 Recommended Connections for Unused Pins
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Accurate Current Sense
      2. 8.3.2 Programmable Current Limit
        1. 8.3.2.1 Capacitive Charging
      3. 8.3.3 Inductive-Load Switching-Off Clamp
      4. 8.3.4 Inductive Load Demagnetization
      5. 8.3.5 Full Protection and Diagnostics
        1. 8.3.5.1 Short-Circuit and Overload Protection
        2. 8.3.5.2 Open-Load Detection
        3. 8.3.5.3 Thermal Protection Behavior
        4. 8.3.5.4 Overvoltage (OVP) Protection
        5. 8.3.5.5 UVLO Protection
        6. 8.3.5.6 Reverse Polarity Protection
        7. 8.3.5.7 Protection for MCU I/Os
      6. 8.3.6 Diagnostic Enable Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Working Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Dynamically Changing Current Limit
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Without a GND Network
        2. 9.4.2.2 With a GND Network
        3. 9.4.2.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

Figure 5-1 PWP Package,14-Pin HTSSOPTop View
Table 5-1 Pin Functions over operating free-air temperature range (unless otherwise noted)
PIN TYPE(1) DESCRIPTION
NAME NO
DIAG_EN 3 I Enable/disable pin for diagnostics, internal pulldown (Active high signal)
EN 2 I Enables/disables channel output current, internal pullup. EN = 1: ON or EN = 0: OFF (Active high signal)
FAULT 4 O Open drain fault output. Referred to as FAULT, FLT, or fault pin. (Active low signal)
GND 1 Power Ground of device. Connect to resistor- diode ground network to have reverse supply/battery protection
ILIM 7 O Adjustable current limit. Short to ground or leave floating for internal fixed current limit.
NC 11 N/A No internal connection. Leave floating
OL_ON / LATCH 5 I OL_ON: Enable/disable pin for open load detection in the ON state. (Active high signal)

Latch: Sets retry behavior. LATCH =0: auto-retry after faults or LATCH =1: latch off after faults, internal pulldown.
 
Pad Thermal Pad -- Thermal Pad, internally shorted to ground. Tie to IC ground externally.
SNS 6 O Analog current output proportional to load current - Connect a resistor to GND to convert to voltage.
VOUT 8, 9, 10 Power Output of high side switch, connected to load
VS 12, 13, 14 Power Power supply Input
(1) I = input, O = output