SLVSGM1C July   2023  – April 2025 TPSM828301 , TPSM828302 , TPSM828303

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information RDS Package
    5. 6.5 Thermal Information VCB Package
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pulse Width Modulation (PWM) Operation
      2. 7.3.2 Power Save Mode (PSM) Operation
      3. 7.3.3 Start-Up and Soft Start
      4. 7.3.4 Switch Cycle-by-Cycle Current Limit
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Thermal Shutdown
      7. 7.3.7 Optimized EMI Performance
      8. 7.3.8 VOUT Accuracy
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable, Disable, and Output Discharge
      2. 7.4.2 Minimum Duty Cycle and 100% Mode Operation
      3. 7.4.3 Power Good
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting The Output Voltage
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Output Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

10 Revision History

Changes from Revision B (June 2024) to Revision C (April 2025)

  • Added bullet "MagPack technology shields inductor and IC"Go
  • Deleted bullet "Measurements according to CISPR available"Go
  • Deleted "PSpice and SIMPLIS models available" bulletGo
  • Updated bullet with package options to include package height and "with no bondwires" Go
  • Deleted TPSM828303PVCBR (Advance information) from the Device Information table. Go
  • Deleted package height from the Device Information tableGo
  • Added TPSM828301 (VCB) and TPSM828302 (VCB) (Preview information) to Device Information table Go
  • Added "a family of 1A, 2A, and 3A, pin-to-pin compatible" in the Description Go
  • Changed from "Based on the DCS-Control topology, the devices have a fast transient response yet with small output capacitance" to "The devices use DCS-Control topology for fast transient response with small output capacitance" in the Description Go
  • Changed from "The power save mode prolongs battery life at low output currents and the forced PWM mode maintains continuous conduction in the inductor to reduce ripple at constant switching frequency" to "The power save mode is for longer battery life and the forced PWM mode reduces ripple with continuous conduction in the inductor at a quasi fixed switching frequency" in the Description Go
  • Changed from "An internal soft-start circuit ramps the voltage up tightly controlled and a power-good signal indicates correct output voltage" to "An internal soft-start circuit reduces inrush current and a power-good signal indicates correct output voltage" in the Description Go
  • Deleted "The devices support 100% mode" from the Description Go
  • Changed from "3.0mm × 3.0mm × 1.95mm QFN package and 2.5mm × 2.6mm × 1.95mm" to "3.0mm × 3.0mm QFN package and in the 2.5mm × 2.6mm" in the Description Go
  • Deleted "Advance information (not Production Data)" table note from TPSM828303PVCBR in the Device Options tableGo
  • Added TPSM828303KPVCBR, TPSM828301APVCBR, and TPSM828302APVCBR with "Preview information (not Production Data)" table note in the Device Options table. Go
  • Changed TPSM828303PVCBR advance information to TPSM828303APVCBR for release to production in the Device Options table Go
  • Added column with soft-start time information in the Device Options tableGo
  • Change the description of pin 8 in both Pin Functions tables from "which is connected to the internal power MOSFET and the inductor. Avoid connecting this pin to larger traces as this can increase EMI. this pin can stay unconnected or be soldered " to "internally connected the inductor. For lowest EMI, leave this pin unconnected or solder this pin "Go
  • Deleted VOUT from line 1 in Absolute Maximum Ratings Go
  • Added two additional lines for voltage in Absolute Maximum Ratings, one for pins SW (DC), VOS, and VOUT and one for SW (AC, < 10ns) with table note "While switching"Go
  • Added parameter tSS in Electrical Characteristics table in section STARTUP for device version TPSM828303xKGo
  • Changed parameter name td(PG) to td(PGO) in section POWER GOOD for deglitch delay during operationGo
  • Added table note to parameter VFB in section REFERENCE VOLTAGE indicating the parameter is a DC parameterGo
  • Changed paragraph "The VCB package version uses MagPack technology for even further EMI reduction. MagPack, a Texas Instruments proprietary integrated-magnetics packaging technology, delivers the highest-performance power module design. Besides EMI reduction, MagPack enhances efficiency and thermal properties of power modules. This feature enables an industry-leading power density" to "The VCB package version uses MagPack technology to deliver the highest-performance power module design. Leveraging the Texas Instruments proprietary integrated-magnetics MagPack packaging technology, these power modules deliver industry-leading power density, high efficiency and good thermal performance, ease of use, and reduced EMI emissions"Go
  • Added table note about inductance of the integrated inductorGo
  • Changed inductance of integrated inductor in the VCB package version from 340nH to 400nH. Go
  • Changed start-up time values from fixed values in text to references into spec table. Go
  • Added description about the relation between output capacitor selection and start-up time with reference to the version TPSM82830xK for slower start-upGo
  • Added VOUT Accuracy sectionGo
  • Changed PG signal delay time values from fixed values in text to references into spec table. Go
  • Changed inductance of VCB package version from 340nH to 400nH.Go
  • Changed figure from fixed values for VIN and VOUT and the resistors to references into the Design Parameters table and the BOM tableGo
  • Added resistor value for 1.8V VOUT in List of Components tableGo
  • Changed outdated instructions for using WEBENCH Tools to current instructions Go
  • Added three figures with the title "PG to VOUT Influence"Go
  • Changed outdated instructions for using WEBENCH Tools to current instructions Go

Changes from Revision A (December 2023) to Revision B (June 2024)

  • Added TPSM828303PVCBR (Advance Information)Go