SLVSHB3 November   2025 LM51251A-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Device Configuration (CFG-pin)
      2. 6.3.2  Device and Phase Enable/Disable (UVLO/EN, EN2)
      3. 6.3.3  Dual Device Operation
      4. 6.3.4  Switching Frequency and Synchronization (SYNCIN)
      5. 6.3.5  Dual Random Spread Spectrum (DRSS)
      6. 6.3.6  Operation Modes (BYPASS, DEM, FPWM)
      7. 6.3.7  VCC Regulator, BIAS (BIAS-pin, VCC-pin)
      8. 6.3.8  Soft Start (SS-pin)
      9. 6.3.9  VOUT Programming (VOUT, ATRK, DTRK)
      10. 6.3.10 Protections
        1. 6.3.10.1 VOUT Overvoltage Protection (OVP)
        2. 6.3.10.2 Thermal Shutdown (TSD)
      11. 6.3.11 Fault Indicator (nFAULT-pin)
      12. 6.3.12 Slope Compensation (CSP1, CSP2, CSN1, CSN2)
      13. 6.3.13 Current Sense Setting and Switch Peak Current Limit (CSP1, CSP2, CSN1, CSN2)
      14. 6.3.14 Input Current Limit and Monitoring (ILIM, IMON, DLY)
      15. 6.3.15 Maximum Duty Cycle and Minimum Controllable On-time Limits
      16. 6.3.16 Signal Deglitch Overview
      17. 6.3.17 MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LOx, HOx, HBx-pin)
      18. 6.3.18 I2C Features
        1. 6.3.18.1 Register VOUT (0x0)
        2. 6.3.18.2 Register Configuration 1 (0x1)
        3. 6.3.18.3 Register Configuration 2 (0x2)
        4. 6.3.18.4 Register Configuration 3 (0x3)
        5. 6.3.18.5 Register Operation State (0x4)
        6. 6.3.18.6 Register Status Byte (0x5)
        7. 6.3.18.7 Register Clear Faults (0x6)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown State
    5. 6.5 Programming
      1. 6.5.1 I2C Bus Operation
  8. LM51251A-Q1 Registers
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Feedback Compensation
      2. 8.1.2 Non-synchronous Application
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Determine the Total Phase Number
        2. 8.2.2.2  Determining the Duty Cycle
        3. 8.2.2.3  Timing Resistor RT
        4. 8.2.2.4  Inductor Selection Lm
        5. 8.2.2.5  Current Sense Resistor Rcs
        6. 8.2.2.6  Current Sense Filter RCSFP, RCSFN, CCS
        7. 8.2.2.7  Low-Side Power Switch QL
        8. 8.2.2.8  High-Side Power Switch QH
        9. 8.2.2.9  Snubber Components
        10. 8.2.2.10 Vout Programming
        11. 8.2.2.11 Input Current Limit (ILIM/IMON)
        12. 8.2.2.12 UVLO Divider
        13. 8.2.2.13 Soft Start
        14. 8.2.2.14 CFG Settings
        15. 8.2.2.15 Output Capacitor Cout
        16. 8.2.2.16 Input Capacitor Cin
        17. 8.2.2.17 Bootstrap Capacitor
        18. 8.2.2.18 VCC Capacitor CVCC
        19. 8.2.2.19 BIAS Capacitor
        20. 8.2.2.20 VOUT Capacitor
        21. 8.2.2.21 Loop Compensation
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Efficiency
        2. 8.2.3.2 Steady State Waveforms
        3. 8.2.3.3 Step Load Response
        4. 8.2.3.4 Sync Operation
        5. 8.2.3.5 AC Loop Response Curve
        6. 8.2.3.6 Thermal Performance
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

LM51251A-Q1 Registers

Table 7-1 lists the memory-mapped registers for the LM51251A-Q1 registers. All register offset addresses not listed in Table 7-1 should be considered as reserved locations and the register contents should not be modified.

Table 7-1 LM51251A-Q1 Registers
OffsetAcronymRegister NameSection
0hVOUTVOUTSection 7.1
1hCONFIGURATION_1CONFIGURATION_1Section 7.2
2hCONFIGURATION_2CONFIGURATION_2Section 7.3
3hCONFIGURATION_3CONFIGURATION_3Section 7.4
4hOPERATION_STATEOPERATION_STATESection 7.5
5hSTATUS_BYTESTATUS_BYTESection 7.6
6hCLEAR_FAULTSCLEAR_FAULTSSection 7.7

Complex bit access types are encoded to fit into small table cells. Table 7-2 shows the codes that are used for access types in this section.

Table 7-2 LM51251A-Q1 Access Type Codes
Access TypeCodeDescription
Read Type
RRRead
Write Type
WWWrite
Reset or Default Value
-nValue after reset or the default value

7.1 VOUT Register (Offset = 0h) [Reset = 3Fh]

VOUT is shown in Table 7-3.

Return to the Summary Table.

Output Voltage Programming

Table 7-3 VOUT Register Field Descriptions
BitFieldTypeResetDescription
7-6NILR0hThis bit is not implemented in hardware. During write operations data for this bit is ignored. During read operations 0 is returned.
5-0VOUTR/W3FhOutput voltage setting or ATRK/DTRK-pin VOUT programming.
  • 0h = 6V
  • 1h = 7V
  • 2h = 8V
  • 3h = 9V
  • 4h = 10V
  • 5h = 11V
  • 6h = 12V
  • 7h = 13V
  • 8h = 14V
  • 9h = 15V
  • Ah = 16V
  • Bh = 17V
  • Ch = 18V
  • Dh = 19V
  • Eh = 20V
  • Fh = 21V
  • 10h = 22V
  • 11h = 23V
  • 12h = 24V
  • 13h = 25V
  • 14h = 26V
  • 15h = 27V
  • 16h = 28V
  • 17h = 29V
  • 18h = 30V
  • 19h = 31V
  • 1Ah = 32V
  • 1Bh = 33V
  • 1Ch = 34V
  • 1Dh = 35V
  • 1Eh = 36V
  • 1Fh = 37V
  • 20h = 38V
  • 21h = 39V
  • 22h = 40V
  • 23h = 41V
  • 24h = 42V
  • 25h = 43V
  • 26h = 44V
  • 27h = 45V
  • 28h = 46V
  • 29h = 47V
  • 2Ah = 48V
  • 2Bh = 49V
  • 2Ch = 50V
  • 2Dh = 51V
  • 2Eh = 52V
  • 2Fh = 53V
  • 30h = 54V
  • 31h = 55V
  • 32h = 56V
  • 33h = 57V
  • 34h = 58V
  • 35h = 59V
  • 36h = 60V
  • 37h = ATRK/DTRK
  • 38h = ATRK/DTRK
  • 39h = ATRK/DTRK
  • 3Ah = ATRK/DTRK
  • 3Bh = ATRK/DTRK
  • 3Ch = ATRK/DTRK
  • 3Dh = ATRK/DTRK
  • 3Eh = ATRK/DTRK
  • 3Fh = ATRK/DTRK

7.2 CONFIGURATION_1 Register (Offset = 1h) [Reset = 04h]

CONFIGURATION_1 is shown in Table 7-4.

Return to the Summary Table.

Device Configuration 1

Table 7-4 CONFIGURATION_1 Register Field Descriptions
BitFieldTypeResetDescription
7-6NILR0hThis bit is not implemented in hardware. During write operations data for this bit is ignored. During read operations 0 is returned.
5-4OVP_MAXR/W0hOVP threshold.
  • 0h = 64V
  • 1h = 50V
  • 2h = 35V
  • 3h = 28.5V
3NFAULT_TWARNR/W0hnFault-pin bahvior on TWARN.
  • 0h = nFAULT-pin not reacting on the thermal warning signal (default)
  • 1h = nFault-pin reacts on thermal warning signal and is pulled low
2-0VOUT_SLEWR/W4hOutput voltage slew rate setting.
  • 0h = no slew rate control
  • 1h = 1 V / 100 us
  • 2h = 1 V / 200 us
  • 3h = 1 V / 400 us
  • 4h = 1 V / 800 us
  • 5h = 1 V / 1.6 ms
  • 6h = 1 V / 3.2 ms
  • 7h = 1 V / 6.4 ms

7.3 CONFIGURATION_2 Register (Offset = 2h) [Reset = 80h]

CONFIGURATION_2 is shown in Table 7-5.

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Device Configuration 2

Table 7-5 CONFIGURATION_2 Register Field Descriptions
BitFieldTypeResetDescription
7OVP_MAX_LATCHR/W1hSets the device behavior when the maximum Overvoltage Protection Level (OVP_max) is reached.
  • 0h = 1V Hysteresis
  • 1h = Shutdown and latch
6-5OPERATION_MODER/W0hOperation Mode selection (MODE-pin, DEM, FPWM).
  • 0h = MODE-pin
  • 1h = DEM
  • 2h = FPWM
  • 3h = FPWM
4NFAULT_OVPR/W0hSets the nFAULT-pin behavior when Undervoltage or Overvoltage is detected. When enabled nFAULT-pin is pulled low when VOUT is above the Overvoltage Protection threshold (OVP or OVP_max) or below the Undervoltage threshold (UV). When disabled nFAULT-pin is only pulled low when VOUT is below the UV (Undervoltage) threshold.
  • 0h = disable
  • 1h = enable
3ICL_LATCHR/W0hSelects if the device shuts down when peak current limit is exceeded by 20 percent (enabled) or if the device continues operation (disabled).
  • 0h = disable
  • 1h = enable
2SPREAD_SPECTRUMR/W0hEnabled / disables clock dithering (Spread Spectrum).
  • 0h = disable
  • 1h = enable
1EN2R/W0hPhase 2 enable. The EN2-pin is overwritten when this bit is set to "1".
  • 0h = EN2-pin
  • 1h = enable phase 2
0UVLOR/W0hThe device behaves as if UVLO/EN is above the UVLO rising threshold when this bit is set to "1". The UVLO function is therefore disabled as long as this bit is set to "1". When the bit is set to "0" the UVLO function is again controlled by the UVLO/EN-pin.
  • 0h = UVLO/EN-pin
  • 1h = overwrite UVLO function

7.4 CONFIGURATION_3 Register (Offset = 3h) [Reset = A1h]

CONFIGURATION_3 is shown in Table 7-6.

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Device Configuration 3

Table 7-6 CONFIGURATION_3 Register Field Descriptions
BitFieldTypeResetDescription
7-6TSDWR/W2hThermal Shutdown Warning setting. The TSD_WARN flag is set when the delta temperature in respect to TTSD-RISING is reached.
  • 0h = 20°C
  • 1h = 35°C
  • 2h = 50°C
  • 3h = 70°C
5-3DEAD_TIMER/W4hDead Time setting. This bit selects the minimum dead time.
  • 0h = 14ns
  • 1h = 30ns
  • 2h = 50ns
  • 3h = 75ns
  • 4h = 100ns
  • 5h = 125ns
  • 6h = 150ns
  • 7h = 200ns
2-0SINGLE_DUALR/W1hSingle or Dual-chip Configuration.
  • 0h = Single Device; Phase2 = 180°; SYNCIN = off; SYNCOUT = off; SYNCOUT phase shift = off; Clock Dithering = SPREAD_SPECTRUM setting
  • 1h = Single Device ext. clock; Phase2 = 180°; SYNCIN = on; SYNCOUT = off; SYNCOUT phase shift = off; Clock Dithering = disabled
  • 2h = Primary Device; Phase2 = 240°; SYNCIN = off; SYNCOUT = on; SYNCOUT phase shift = 120°; Clock Dithering = SPREAD_SPECTRUM setting
  • 3h = Primary Device; Phase2 = 180°; SYNCIN = off; SYNCOUT = on; SYNCOUT phase shift = 90°; Clock Dithering = SPREAD_SPECTRUM setting
  • 4h = Primary Device ext. clock; Phase2 = 240°; SYNCIN = on; SYNCOUT = on; SYNCOUT phase shift = 120°; Clock Dithering = disabled
  • 5h = Primary Device ext. clock; Phase2 = 180°; SYNCIN = on; SYNCOUT = on; SYNCOUT phase shift = 90°; Clock Dithering = disabled
  • 6h = Secondary Device; Phase2 = 180°; SYNCIN = on; SYNCOUT = off; SYNCOUT phase shift = off; Clock Dithering = disabled
  • 7h = Secondary Device; Phase2 = 180°; SYNCIN = on; SYNCOUT = off; SYNCOUT phase shift = off; Clock Dithering = disabled

7.5 OPERATION_STATE Register (Offset = 4h) [Reset = 00h]

OPERATION_STATE is shown in Table 7-7.

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Device Operation State

Table 7-7 OPERATION_STATE Register Field Descriptions
BitFieldTypeResetDescription
7-4NILR0hThis bit is not implemented in hardware. During write operations data for this bit is ignored. During read operations 0 is returned.
3-0STATER0hThis bit shows in which operation state the device is.
  • 0h = Standby
  • 1h = Start Phase 1 & 2
  • 2h = Active DEM
  • 3h = Active FPWM
  • 4h = Bypass
  • 5h = HBx Fault
  • 6h = VCC Fault
  • 7h = FAULT
  • 8h = Thermal Shutdown
  • 9h = VCC CHECK

7.6 STATUS_BYTE Register (Offset = 5h) [Reset = 00h]

STATUS_BYTE is shown in Table 7-8.

Return to the Summary Table.

Fault status low byte

Table 7-8 STATUS_BYTE Register Field Descriptions
BitFieldTypeResetDescription
7CMLR0hCommunication, Logic, Memory error.
  • 0h = no fault
  • 1h = fault
6HB_FAULTR0hHigh side driver UVLO triggered.
  • 0h = no fault
  • 1h = fault
5ICL_FAULTR0hPeak current limit +20 percent triggered.
  • 0h = no fault
  • 1h = fault
4ILIM_FAULTR0hAverage input current limit triggered.
  • 0h = no fault
  • 1h = fault
3VOUT_OVPR0hOvervoltage Protection (OVP) triggered.
  • 0h = no fault
  • 1h = fault
2VOUT_UVPR0hUndervoltage Protection (UVP) triggered.
  • 0h = no fault
  • 1h = fault
1TSDR0hThermal Shutdown triggered.
  • 0h = no fault
  • 1h = fault
0TSD_WARNR0hThermal Shutdown warning. Device is close to thermal shutdown.
  • 0h = no warning
  • 1h = warning

7.7 CLEAR_FAULTS Register (Offset = 6h) [Reset = 00h]

CLEAR_FAULTS is shown in Table 7-9.

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Clear all latched status flags

Table 7-9 CLEAR_FAULTS Register Field Descriptions
BitFieldTypeResetDescription
7-0CLEAR_FAULTSR0hAccessing the address is enough to clear the faults in the STATUS_BYTE Register 0x05.