SLVSHP8 January   2026 TPS544B28

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  D-CAP4 Control
      2. 7.3.2  Internal VCC LDO and Using External Bias On the VCC Pin
        1. 7.3.2.1 Powering the Device From a Single Bus
        2. 7.3.2.2 Powering the Device From a Split-Rail Configuration
      3. 7.3.3  Multifunction Select (MS1) Pin
      4. 7.3.4  Multifunction Select (MS2) Pin
      5. 7.3.5  Address (ADR) Pin
      6. 7.3.6  Enable
      7. 7.3.7  Soft Start
      8. 7.3.8  Power Good
      9. 7.3.9  Overvoltage and Undervoltage Protection
      10. 7.3.10 Output Voltage Setting (External Feedback Configuration)
      11. 7.3.11 Remote Sense
      12. 7.3.12 Low-side MOSFET Zero-Crossing
      13. 7.3.13 Current Sense and Positive Overcurrent Protection
      14. 7.3.14 Low-side MOSFET Negative Current Limit
      15. 7.3.15 Output Voltage Discharge
      16. 7.3.16 UVLO Protection
      17. 7.3.17 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Auto-Skip (PFM) Eco-mode Light Load Operation
      2. 7.4.2 Forced Continuous-Conduction Mode
  9. Programming Registers
    1. 8.1  OPERATION (Address = 1h) [Reset = 00h]
    2. 8.2  ON_OFF_CONFIG (Address = 2h) [Reset = XXh]
    3. 8.3  CLEAR_FAULTS (Address = 3h) [Reset = 00h]
    4. 8.4  WRITE_PROTECT (Address = 10h) [Reset = 00h]
    5. 8.5  STORE_USER_ALL (Address = 15h) [Reset = 00h]
    6. 8.6  RESTORE_USER_ALL (Address = 16h) [Reset = 00h]
    7. 8.7  CAPABILITY (Address = 19h) [Reset = C0h]
    8. 8.8  VOUT_MODE (Address = 20h) [Reset = 96h]
    9. 8.9  VOUT_COMMAND (Address = 21h) [Reset = 0000h]
    10. 8.10 VOUT_MARGIN_HIGH (Address = 25h) [Reset = 0000h]
    11. 8.11 VOUT_MARGIN_LOW (Address = 26h) [Reset = 0000h]
    12. 8.12 VOUT_TRANSITION_RATE (Address = 27h) [Reset = E81Ah]
    13. 8.13 VOUT_SCALE_LOOP (Address = 29h) [Reset = E804h]
    14. 8.14 FREQUENCY_SWITCH (Address = 33h) [Reset = 380Xh]
    15. 8.15 VOUT_OV_FAULT_RESPONSE (Address = 41h) [Reset = XXh]
    16. 8.16 VOUT_UV_FAULT_RESPONSE (Address = 45h) [Reset = XXh]
    17. 8.17 IOUT_OC_FAULT_LIMIT (Address = 46h) [Reset = 00XXh]
    18. 8.18 TON_DELAY (Address = 60h) [Reset = 000Xh]
    19. 8.19 TON_RISE (Address = 61h) [Reset = F80Xh]
    20. 8.20 TOFF_DELAY (Address = 64h) [Reset = 000Xh]
    21. 8.21 TOFF_FALL (Address = 65h) [Reset = F80Xh]
    22. 8.22 STATUS_BYTE (Address = 78h) [Reset = 81h]
    23. 8.23 STATUS_WORD (Address = 79h) [Reset = 2800h]
    24. 8.24 STATUS_CML (Address = 7Eh) [Reset = 00h]
    25. 8.25 STATUS_MFR_SPECIFIC (Address = 80h) [Reset = 00h]
    26. 8.26 READ_VOUT (Address = 8Bh) [Reset = 0000h]
    27. 8.27 READ_IOUT (Address = 8Ch) [Reset = DXXXh]
    28. 8.28 READ_TEMP1 (Address = 8Dh) [Reset = 0XXXh]
    29. 8.29 PMBUS_REVISION (Address = 98h) [Reset = 55h]
    30. 8.30 MFR_ID (Address = 99h) [Reset = 4954h]
    31. 8.31 MFR_MODEL (Address = 9Ah) [Reset = 00284B54h]
    32. 8.32 MFR_REVISION (Address = 9Bh) [Reset = X0h]
    33. 8.33 IC_DEVICE_ID (Address = ADh) [Reset = 00284B544954h]
    34. 8.34 IC_DEVICE_REV (Address = AEh) [Reset = 00h]
    35. 8.35 SYS_CFG_USER1 (Address = D1h) [Reset = XXh]
    36. 8.36 PASSKEY (Address = D2h) [Reset = X0h]
    37. 8.37 COMP (Address = D4h) [Reset = XXh]
    38. 8.38 VBOOT (Address = D5h) [Reset = XXh]
    39. 8.39 NVM_CHECKSUM (Address = D9h) [Reset = 0000h]
    40. 8.40 FUSION_ID0 (Address = FCh) [Reset = 02C0h]
    41. 8.41 FUSION_ID1 (Address = FDh) [Reset = 4h]
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Voltage Setting Point
        2. 9.2.2.2 Choose the Switching Frequency
        3. 9.2.2.3 Choose the Inductor
        4. 9.2.2.4 Choose the Output Capacitor
        5. 9.2.2.5 Choose the Input Capacitors (CIN)
        6. 9.2.2.6 VCC Bypass Capacitor
        7. 9.2.2.7 BOOT Capacitor
        8. 9.2.2.8 PG Pullup Resistor
        9. 9.2.2.9 Choose the PMBus® Address and Fault Recovery Mode
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Design Requirements

This design uses the parameters listed in the following table.

Table 9-1 Design Example Specifications
SPECIFICATION TEST CONDITIONS MIN TYP MAX UNIT
VIN voltage range 8 12 16 V
Input current VIN = 8V, IOUT = 20A 9 A
VIN start voltage Set by EN pin resistor divider 3.84 V
Output voltage setpoint VOUT= 3.3V set by MS2 pin selection. 3.3 V
Output current range VIN = 8V to 16V 0 20 A
Load transient response IOUT = 5A to 15A Voltage change –99 mV
IOUT = 15A to 5A Voltage change 99 mV
Output ripple voltage IOUT = 20A 16 mVPP
Soft-start time From start of switching to VOUT = 3.3V, tSS = 1ms setting 0.8 1 1.2 ms
Current limit OCP = 21A setting by MS1 pin selection 19 21 23 A
Switching frequency (fSW) fSW = 800kHz setting by MS1 pin selection 800 kHz
IC case temperature IOUT = 20A, 15-minute soak 77.4 °C