SLVSHS0C March   2025  – September 2026 TPS482H85-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics 24V
    8. 6.8 Switching Characteristics 48V
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Current and Voltage Conventions
      2. 7.3.2 Accurate Current Sense
      3. 7.3.3 Adjustable Current Limit
        1. 7.3.3.1 Short-Circuit Reliability
      4. 7.3.4 Inductive-Load Switching-Off Clamp
      5. 7.3.5 Fault Detection and Reporting
        1. 7.3.5.1 Diagnostic Enable Function
        2. 7.3.5.2 Multiplexing of Current Sense
        3. 7.3.5.3 FLT Reporting
        4. 7.3.5.4 Fault Table
      6. 7.3.6 Full Diagnostics
        1. 7.3.6.1 Short-to-GND and Overload Detection
        2. 7.3.6.2 Open-Load Detection
          1. 7.3.6.2.1 Channel On
          2. 7.3.6.2.2 Channel Off
        3. 7.3.6.3 Short-to-Battery Detection
        4. 7.3.6.4 Reverse-Polarity and Battery Protection
        5. 7.3.6.5 Thermal Fault Detection
          1. 7.3.6.5.1 Thermal Protection Behavior
      7. 7.3.7 Full Protections
        1. 7.3.7.1 UVLO Protection
        2. 7.3.7.2 Loss of GND Protection
        3. 7.3.7.3 Loss of Power Supply Protection
        4. 7.3.7.4 Loss of VDD
        5. 7.3.7.5 Reverse Current Protection
        6. 7.3.7.6 Protection for MCU I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operational Modes
        1. 7.4.1.1 SLEEP
        2. 7.4.1.2 DIAGNOSTIC
        3. 7.4.1.3 ACTIVE
        4. 7.4.1.4 FAULT
        5. 7.4.1.5 STANDBY DELAY
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
        1. 8.4.2.1 Without a GND Network
        2. 8.4.2.2 With a GND Network
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

7.4.1.4 FAULT

The FAULT state occurs when the ENx pins are high but some event has caused the channel to behave differently from normal operation. These fault events include: absolute thermal shutdown, relative thermal shutdown, and current limit. Each of these fault events either directly or eventually shut off the channel to protect the device and system. After the device shuts off and waits for tRETRY amount of time and has cooled below the THYS threshold, the outputs that are on try to come back on again and the device transitions back into the ACTIVE state or DIAGNOSTIC state.