SLVSIC5 September   2026 DRV81315-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
    1.     Pin Functions
  6. 5Specification
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Transient thermal impedance and Current capability
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Off state diagnostics (OL, STG)
      2. 6.3.2 Control Interface / Power input
    4. 6.4 Protection Circuits
      1. 6.4.1 Overvoltage clamp
        1. 6.4.1.1 Demagnetization energy capability
          1. 6.4.1.1.1 Single pulse clamping capability
      2. 6.4.2 Overcurrent limit
      3. 6.4.3 Thermal Shutdown (TSD)
        1. 6.4.3.1 Dynamic Overtemperature Stress (ΔTDYN)
        2. 6.4.3.2 Absolute Overtemperature
      4. 6.4.4 Undervoltage Lockout (UVLO)
      5. 6.4.5 Summary of STATUS pin response
  8. 7Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 External components
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
    3. 7.3 Thermal Consideration
      1. 7.3.1 Power Dissipation
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Community Resources
    3. 8.3 Trademarks
  10. 9Mechanical, Packaging, and Orderable Information
6.4.1.1.1 Single pulse clamping capability

The maximum energy and corresponding load inductance, load current the device can withstand for one pulse inductive dissipation at 125°C is shown here. The device can withstand 40% of this energy for one million inductive repetitive pulses with a >4-Hz repetitive pulse. If the application parameters exceed this device limit, use a protection device like a freewheeling diode to dissipate the energy stored in the inductor

DRV81315-Q1 Single pulse clamping energy (per channel) at TJ = 150C (DDA package)Figure 6-6 Single pulse clamping energy (per channel) at TJ = 150C (DDA package)